Ultrasonic Adhesion for Flat Panel Display Substrates
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Solution Overview
Problem
The manufacturing of large-area flat panel displays using plastic substrates is hindered by substrate bending/warping due to heat expansion coefficient differences and increased costs from the use of adhering films, which require high-temperature processing and additional processing steps.
Innovation Solution
A method involving ultrasonic waves to adhere flexible substrates to supporting plates using thin layers of adhering particles and polyelectrolytes, eliminating the need for additional films and high-temperature processes, allowing for the reuse of supporting plates and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an adhering film is used to adhere the plastic substrate to the supporting plate, then the substrate can be supported during manufacturing, but the number of manufacturing steps increases and processing cost increases
Solution Approach 1:
The patent removes the adhering film layer from the manufacturing process. Instead of using a separate adhering film, the plastic substrate is directly adhered to the supporting plate through ultrasonic welding, eliminating the intermediate layer and reducing manufacturing steps while maintaining support stability
Solution Approach 2:
The patent combines the adhering function and the supporting function into a single integrated structure. The supporting plate directly provides both support and adhesion through ultrasonic welding, eliminating the need for a separate adhering film layer
2Reliability
If an adhering film is used to adhere the plastic substrate to the supporting plate, then the substrate can be adhered, but processing cost increases due to removal requirements
Solution Approach 1:
The patent eliminates the adhering film and its associated removal process. Ultrasonic welding creates a permanent bond between the substrate and supporting plate that requires no removal step, reducing processing costs while maintaining adhesion
Solution Approach 2:
The patent uses a disposable or reusable supporting plate with direct adhesion capability through ultrasonic welding, eliminating the need for expensive adhering films and their removal processes
3Reliability
If high-temperature processing is used to harden and melt the adhering film, then the substrate can be adhered to the supporting plate, but the plastic substrate curves due to heat expansion coefficient differences
Solution Approach 1:
The patent replaces thermal adhesion (heating to melt adhering film) with ultrasonic welding (mechanical vibration). This substitution eliminates high-temperature processing and the associated thermal expansion issues that cause substrate curvature
Solution Approach 2:
The patent changes the adhesion mechanism from thermal (high temperature) to mechanical (ultrasonic vibration). This parameter change allows adhesion at lower temperatures, preventing heat-induced substrate curvature while maintaining bonding reliability
4Reliability
If the plastic substrate is adhered to the supporting plate using conventional methods, then adhesion is achieved, but large-area displays cannot be manufactured due to substrate bending
Solution Approach 1:
The patent uses ultrasonic welding instead of thermal adhesion, enabling large-area substrate adhesion without the heat-induced expansion and bending that limits conventional methods to smaller display sizes
Solution Approach 2:
The patent changes the adhesion temperature parameter from high (conventional thermal method) to low (ultrasonic welding), enabling manufacturing of large-area displays by preventing heat-induced substrate deformation across large surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of large-area flat panel displays without substrate bending/warping and decreases overall manufacturing costs by eliminating the need for adhering films and high-temperature processing, while allowing for the reuse of supporting plates.
Implementation Method 1
using ultrasonic waves to adhere the first supporting plate to the first substrate
Implementation Method 2
The first adhering member made of the plurality of adhering particles is melted by using the ultrasonic waves
Implementation Method 3
The polyelectrolyte may electrostatically couple the plurality of adhering particles to the first supporting plate
Implementation Method 4
removing the first adhering member and the second adhering member by using a laser beam to separate the first supporting plate and the second supporting plate from the first substrate and the second substrate
Data Source
AI summary
A manufacturing method of a flat panel display according to an exemplary embodiment of the present invention includes: coating a first adhering member on a first supporting plate; disposing a first substrate on the first adhering member; using ultrasonic waves to adhere the first supporting plate and the first substrate; and forming a gate line, a data line, a thin film transistor connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor on the first substrate. According to the manufacturing method of the flat panel display according to an exemplary embodiment of the present invention, the first adhering member made of the plurality of adhering particles is melted by using the ultrasonic waves without an additional adhering film to adhere the flexible first substrate and the first supporting plate, thereby reducing the overall manufacturing cost.