Ultrasonic Pad Bonding via Intermediary Substrate
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Solution Overview
Problem
Current display devices face challenges in processing reliability due to issues with pad bonding during the fabrication of display panels, particularly with the use of ultrasonic wave bonding methods, which can result in slip phenomena and reduced contact reliability between pads.
Innovation Solution
The implementation of a display device design that includes a flexible film with a base film and a substrate structure, where the substrate is positioned to overlap the pad portions and is made of materials like plastic or metal, and the use of an ultrasonic wave device with a vibrating part and pressing part to bond the pads, preventing direct contact with the flexible film and maintaining contact reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If ultrasonic wave bonding method is used to bond pads, then bonding efficiency is improved, but slip phenomena occur and contact reliability deteriorates
Solution Approach 1:
A substrate is introduced as an intermediary component between the ultrasonic wave bonding device and the flexible film with pads. The substrate serves as a stable platform that prevents direct contact between the bonding device and the flexible film, thereby eliminating slip phenomena while maintaining efficient ultrasonic wave bonding. This intermediary structure resolves the contradiction by providing both stability for reliable bonding and efficiency for high-speed production.
2Device complexity
If direct contact between ultrasonic wave device and flexible film is allowed, then bonding process is simplified, but slip phenomena occur reducing contact reliability
Solution Approach 1:
The substrate acts as a mediator that simplifies the bonding process by providing a stable, easy-to-handle platform for the ultrasonic wave device to bond pads onto. Instead of directly bonding to the flexible film which causes slipping, the device bonds to the substrate first, then the assembled unit is transferred to the flexible film. This intermediary step reduces overall process complexity while significantly improving contact reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding reliability between pads, preventing slip phenomena and ensuring efficient connectivity, thereby improving the overall processing reliability and performance of the display device.
Implementation Method 1
the use of an ultrasonic wave device with a vibrating part and pressing part to bond the pads
Data Source
AI summary
A display device includes: a display panel including a plurality of pixels that display an image, and a pixel pad portion; a first flexible film electrically connected to the display panel, the first flexible film including a first base film, an output pad portion, and an input pad portion, wherein the first base film includes a surface and an opposite surface facing each other, wherein the output pad portion is disposed on the surface of the first base film and is coupled to the pixel pad portion, and wherein the input pad portion is disposed on the surface of the first base film; a circuit substrate electrically connected to the display panel through the input pad portion, the circuit substrate including a first driving pad portion; and a first substrate disposed on the opposite surface and overlapping either the input pad portion or the output pad portion.