Ultrasonic Probe Backing Insulation via Laminated Coated Lead Frames
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Solution Overview
Problem
The existing ultrasonic probe backings with lead arrays face issues of deteriorated insulating properties due to exposed lead wires and high adhesive usage, leading to potential short-circuits and ion migration in laminated structures.
Innovation Solution
The ultrasonic probe incorporates a backing with laminated plates that have lead rows with insulating coatings, where the leads are directly coupled to the backing material without an adhesive layer, reducing the risk of short-circuits and adhesive usage, and improving acoustic characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lead wires are arranged exposed in the backing material, then the manufacturing process is simplified, but the insulating property of the backing deteriorates due to potential short-circuits from conductive filler particles
Solution Approach 1:
An insulating coating (thin film) is applied to the surface of each lead wire to prevent electrical short-circuits between adjacent leads. This coating acts as a protective barrier that maintains the insulating property of the backing while allowing the lead wires to be arranged in the backing material. The coating is applied before the backing material is formed, ensuring complete coverage of the lead surfaces.
2Strength
If adhesive is used to bond multiple backing plates together, then the structural integrity of the laminated backing is improved, but the amount of adhesive increases leading to potential degradation of acoustic properties and increased cost
Solution Approach 1:
The backing material itself is designed to provide the bonding function between multiple backing plates, eliminating the need for separate adhesive materials. The backing material is formed in a molded state that creates direct mechanical interlocking between plates, allowing the structure to bond itself without external adhesives. This self-service approach maintains structural integrity while avoiding the problems associated with adhesive usage.
Solution Approach 2:
The invention eliminates the use of adhesive by recovering the bonding function to the backing material structure itself. The molded backing plates are designed with features that enable direct bonding through the backing material's own properties, discarding the need for separate adhesive substances and thereby reducing material quantity and associated costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the insulating properties and reduces adhesive usage, preventing short-circuits and improving the acoustic characteristics of the backing, while maintaining uniformity and reducing the risk of ion migration.
Implementation Method 1
each of the leads includes a lead wire and an insulating coating wrapping the lead wire
Implementation Method 2
The backing material includes a mother material (base material) and one or a plurality of fillers for achieving a desired acoustic characteristic
Data Source
AI summary
The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.