Ultrasonic Probe Connection Layer for Signal Transmission
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Solution Overview
Problem
Current ultrasonic probes face challenges in efficient electrical signal transmission due to limitations in connection methods, such as flip chip bonding and wire bonding, which can lead to reduced transmission efficiency and increased complexity, resulting in degraded reliability and larger probe footprints.
Innovation Solution
The ultrasonic probe incorporates a connection layer with a first conductor array and a second conductor array, electrically connecting the transducer array to an ASIC, using a non-conductive material to fill spaces and forming electrodes on the conductors to enhance contact area and transmission efficiency, eliminating the need for flip chip or wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip chip bonding is used to connect transducer array and ASIC, then electrical connection is achieved, but cracks or poor contact occur leading to reduced transmission efficiency
Solution Approach 1:
The connection layer is divided into multiple conductor arrays (first conductor array and second conductor array) that are separately formed and connected through electrodes, eliminating the need for a single complex bonding interface and reducing the risk of cracks or poor contact
Solution Approach 2:
A connection layer with conductor arrays and electrodes is introduced as an intermediary between the transducer array and ASIC, providing a more reliable electrical connection path that avoids direct bonding issues
2Reliability
If wire bonding method is used to connect transducer array and ASIC, then electrical connection is achieved, but manufacturing complexity increases
Solution Approach 1:
The complex wire bonding process is extracted and replaced by a simplified connection layer structure with conductor arrays that can be formed using standard semiconductor fabrication techniques, reducing manufacturing complexity
Solution Approach 2:
The mechanical wire bonding process is replaced with a deposited conductor array structure formed through sputtering or plating methods, eliminating the need for complex bonding operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves electrical signal transmission efficiency, reduces manufacturing complexity, and enhances the reliability of the ultrasonic probe by ensuring robust electrical connections without the drawbacks of traditional bonding methods, leading to improved ultrasonic image quality and reduced manufacturing time and costs.
Implementation Method 1
The electrode may be formed using a sputtering method or a plating method
Implementation Method 2
The electrode may be formed using a sputtering method or a plating method
Data Source
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AI summary
An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.