Ultrasonic Semiconductor Separation for Uniform LED Cut Surfaces

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Solution Overview

Problem

The existing process of separating semiconductor elements from a substrate using mechanical force is time-consuming, operator skill-dependent, and results in non-uniform cut surfaces, potentially damaging the elements.

Innovation Solution

An apparatus utilizing ultrasonic waves to separate semiconductor elements from a substrate, ensuring neat and uniform separation surfaces by applying ultrasonic waves in various directions, including perpendicular and horizontal orientations, with multiple ultrasonic generators positioned strategically around the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If mechanical force is used to separate semiconductor elements from substrate, then separation can be achieved, but the process time is long and operator skill dependency causes non-uniform cut surfaces

Engineering Contradiction:

Improveuniformity of cut surfacesVSAvoidseparation process time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent replaces manual mechanical separation with an automated ultrasonic separation system. Ultrasonic waves are applied to the substrate to vibrate and separate semiconductor elements automatically, eliminating operator skill dependency and achieving uniform cut surfaces while reducing process time through automation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent applies ultrasonic vibration to separate semiconductor elements from the substrate. The ultrasonic waves create high-frequency mechanical vibrations that enable clean, uniform separation of the elements from the substrate without manual intervention, resolving both the precision and time issues

Inventive Principle:

Principle #18Mechanical vibration

2Reliability

If manual mechanical separation is performed, then separation can be achieved, but operator skill level affects quality and elements may be damaged

Engineering Contradiction:

Improvequality consistency of separated elementsVSAvoidautomation system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces complex manual operations with a standardized ultrasonic separation system. The automated system applies controlled ultrasonic energy uniformly across all elements, ensuring consistent quality and reducing damage risk while the system complexity is managed through standardized equipment design

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the separation mechanism from manual mechanical force to ultrasonic wave parameters. By controlling ultrasonic frequency, power, and duration, the system achieves reliable, damage-free separation with consistent quality across different batches, independent of operator skill

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If multiple ultrasonic generators are positioned around the substrate, then uniform separation can be achieved, but device complexity increases

Engineering Contradiction:

Improveuniformity of separation surfacesVSAvoidnumber of ultrasonic generators

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent divides the ultrasonic generation function into multiple generators positioned around the substrate. Each generator handles a specific zone, ensuring uniform energy distribution and separation quality across the entire substrate surface, with each segment contributing to the overall precision

Inventive Principle:

Principle #1Segmentation

4Manufacturing precision

If ultrasonic waves are applied in various directions, then separation quality improves, but energy consumption increases

Engineering Contradiction:

Improveneatness of separation surfacesVSAvoidultrasonic energy consumption

Core Design Contradiction:

Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The patent applies ultrasonic waves from multiple directions (vertical and horizontal) to achieve uniform separation. By positioning generators at different locations around the substrate, the system delivers energy from multiple angles, ensuring neat separation surfaces while optimizing energy distribution to avoid excessive consumption

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces processing time and improves the quality of light-emitting elements by minimizing deviations in length and enhancing the reliability of the separation process, leading to more uniform and efficient fabrication of semiconductor elements.

Implementation Method 1

an apparatus for separating semiconductor elements formed on a substrate by using ultrasonic waves

Methodology Applied

Scientific EffectUltrasonic waves: Ultrasound

Implementation Method 2

at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Data Source

PatentUS20240332265A1Apparatus for separating semiconductor elements and method for fabricating light-emitting elements using the same

Publication Date: 2024.10.03 SAMSUNG DISPLAY CO LTD

AI summary

An apparatus includes a base including a receiving portion that receives a substrate on which semiconductor elements are disposed; and at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base.