Ultrasonic Substrate Separation for Uniform Semiconductor Element Surfaces
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Solution Overview
Problem
The existing process of separating semiconductor elements from a substrate using mechanical force is time-consuming, operator skill-dependent, and results in non-uniform cut surfaces, potentially damaging the elements.
Innovation Solution
An apparatus utilizing ultrasonic waves to separate semiconductor elements from a substrate, ensuring neat and uniform separation surfaces by applying ultrasonic waves in various directions, including perpendicular and horizontal orientations, with multiple ultrasonic generators positioned strategically around the substrate to achieve uniform separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical force is used to separate semiconductor elements from substrate, then separation can be achieved, but the process time is long and operator skill dependency results in non-uniform separation surfaces
Solution Approach 1:
The patent replaces manual mechanical separation with an automated ultrasonic separation system. Multiple ultrasonic generators are positioned at different locations (bottom, sidewalls, inclined portions) to apply ultrasonic waves simultaneously to the substrate, achieving uniform separation surfaces without operator skill dependency and reducing process time
Solution Approach 2:
The patent divides the ultrasonic generation system into multiple independent ultrasonic generators positioned at different locations around the substrate. This segmentation allows each generator to contribute to separating different regions of semiconductor elements, ensuring uniform separation across the entire substrate surface
2Reliability
If manual mechanical force is applied for separation, then the process can be performed with simple equipment, but the cut surfaces are non-uniform and elements may be damaged
Solution Approach 1:
The patent uses multiple ultrasonic generators positioned at different locations (bottom, sidewalls, inclined portions) to apply ultrasonic waves from multiple directions simultaneously. This segmented approach ensures uniform energy distribution across the substrate, preventing element damage and improving reliability while maintaining manageable system complexity
Solution Approach 2:
The patent employs ultrasonic vibration to separate semiconductor elements from the substrate. The ultrasonic generators create high-frequency mechanical vibrations that propagate through the substrate, enabling clean separation without direct mechanical contact that could damage the elements, thus improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the time required for separation, improves the uniformity of separation surfaces, and enhances the reliability of light-emitting elements by minimizing deviations in length and ensuring consistent quality.
Implementation Method 1
an ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base
Implementation Method 2
a first ultrasonic generator disposed at a bottom of the base, and the first ultrasonic generator may generate ultrasonic waves in a direction perpendicular to a lower surface of the receiving portion of the base
Implementation Method 3
second ultrasonic generators disposed on sidewalls of the base in a first direction and third ultrasonic generators disposed on sidewalls in a second direction in a plan view, and the second ultrasonic generators and the third ultrasonic generators may generate ultrasonic waves in a direction horizontal to the lower surface of the base
Data Source
AI summary
An apparatus includes a base including a receiving portion that receives a substrate on which semiconductor elements are disposed; and at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base.