Ultra-Thin LED Display Module Layout With Integrated Power and Receiving Card
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Solution Overview
Problem
LED displayers have a large thickness due to the superposition of LED display modules, cases, and control boxes, making it difficult to achieve an ultra-thin design.
Innovation Solution
The LED display module integrates a power supply and a receiving card within the module, with the power supply located between a heat-dissipation cover and the circuit board, and the receiving card between the shell body and the circuit board, allowing for a compact ultra-thin design and enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the power supply and receiving card are disposed in a separate control box shared by multiple LED display modules, then the control and power management is centralized and simplified, but the thickness of the LED display modules superimposes with the control box resulting in large overall thickness
Solution Approach 1:
The patent divides the control and power management functions into two separate modules: the receiving card is integrated into the LED display module while the power supply remains in the control box. This segmentation allows each component to be optimized independently - the LED display module achieves ultra-thin design without the power supply thickness, while the control box maintains centralized power management for multiple modules.
Solution Approach 2:
The power supply component is extracted from the LED display module and placed in the control box, while the receiving card is extracted from the control box and integrated into the LED display module. This extraction and redistribution of components resolves the thickness issue by removing the power supply from the thin display module while maintaining separate control functionality.
2Length of stationary object
If the LED display module is made ultra-thin by integrating power supply and receiving card within the module, then the overall thickness is reduced, but heat dissipation becomes more challenging due to limited space
Solution Approach 1:
The power supply, which generates significant heat, is extracted from the ultra-thin LED display module and placed in the control box where it can be properly cooled. This extraction eliminates the heat dissipation problem from the thin display module while the control box provides adequate space for thermal management of the power supply.
Solution Approach 2:
The patent segments the thermal management requirements by separating the low-heat receiving card (integrated in the thin module) from the high-heat power supply (placed in the control box). This segmentation allows the display module to maintain ultra-thin design without compromising heat dissipation, as the primary heat-generating component is located elsewhere.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of ultra-thin LED display modules and displayers, facilitating heat dissipation and reducing the overall thickness while maintaining functionality.
Implementation Method 1
a first heat-dissipation cover disposed over a first open region of the shell body; and the LED display module further comprises a power supply and a receiving card which are electrically connected to the circuit board, wherein the power supply is located between the first heat-dissipation cover and the circuit board
Data Source
AI summary
An LED display module and an LED displayer are disclosed. The LED display module comprises a module bottom shell and a circuit board installed in the module bottom shell. The module bottom shell comprises a shell body and a first heat-dissipation cover disposed over a first open region of the shell body. The LED display module further comprises a power supply and a receiving card which are electrically connected to the circuit board. The power supply is located between the first heat-dissipation cover and the circuit board. The receiving card is located between the shell body and the circuit board. The LED display module is ultra-thin, and the LED displayer is made ultra-thin, accordingly.