Ultra-Thin Package Substrate Processing with Carrier-Supported Core Layers
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Solution Overview
Problem
Conventional package substrate manufacturing processes face challenges in processing ultra-thin substrates due to equipment limitations, leading to high costs and the need for specialized equipment to maintain processing conditions such as thickness, warpage, and high-density patterning.
Innovation Solution
A package substrate design featuring double tapered through holes and separate circuit layers on opposite sides of a core layer, processed using conventional equipment with the aid of carriers and support members, allowing for increased structural thickness and compatibility with existing machinery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional processing equipment is used to process ultra-thin substrates, then processing costs are reduced, but the equipment cannot maintain required processing conditions for minimum board thickness
Solution Approach 1:
The patent introduces a carrier as an intermediary substrate that the ultra-thin package substrate is bonded to during processing. This carrier provides the necessary structural support and thickness that conventional equipment requires, enabling the equipment to process the ultra-thin substrate without specialized modifications while maintaining required processing conditions.
2Manufacturing precision
If specialized equipment is purchased to process ultra-thin substrates, then processing conditions such as thickness and warpage can be maintained, but investment cost and processing costs significantly increase
Solution Approach 1:
Instead of modifying or purchasing specialized equipment, the patent uses a carrier as a mediator that provides the necessary structural support during processing. This approach maintains thickness control and warpage prevention capabilities while using existing conventional equipment, thereby avoiding significant investment costs.
Solution Approach 2:
The carrier serves as a temporary, disposable support structure that is used only during the processing stage and then removed. This temporary carrier enables precise processing of ultra-thin substrates without requiring expensive permanent equipment modifications, as the carrier can be discarded after serving its purpose.
3Length of moving object
If the substrate thickness is reduced to achieve light and thin requirements, then product performance is improved, but the ability to process the substrate with conventional equipment is limited
Solution Approach 1:
The carrier acts as an intermediary that compensates for the reduced thickness of the ultra-thin substrate during manufacturing. By bonding the thin substrate to the thicker carrier, the combined structure has sufficient thickness for conventional equipment to process while the substrate itself maintains its ultra-thin characteristics for the final light and thin product requirements.
Data Source
AI summary
Provided is a package substrate. In a manufacturing method thereof, by combining two extremely thin substrates to be processed on opposite sides of a carrier (and/or a support member), a first circuit layer and a second circuit layer are respectively formed on opposite sides of a core layer of the substrate. Therefore, the structural thickness required for the manufacturing process is increased such that the processability of the ultra-thin substrates is not limited by the equipment performance, thereby eliminating the need for specialized equipment and significantly reducing processing costs.