Underfill Resin Alignment Mark for Electronic Component Stacking
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Solution Overview
Problem
Existing electronic component device manufacturing methods face challenges in stabilizing the position alignment of upper electronic components relative to lower components due to the placement of alignment marks at the peripheral edge portions, which are difficult to image-recognize, especially when using low transparency underfill resins.
Innovation Solution
The method involves forming a first underfill resin with a base part and alignment marks on its upper surface around the second electronic component, allowing for clear image recognition and stable alignment of the third electronic component, and subsequently filling a second underfill resin between the second and third components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment marks are formed at the peripheral edge portion of the first semiconductor chip, then the alignment process can be performed, but the position alignment cannot be stably performed by image recognition
Solution Approach 1:
The patent introduces an intermediary alignment mark structure formed on the underfill resin base part, which mediates between the semiconductor chip and the image recognition system. This alignment mark is positioned on the peripheral edge portion of the underfill resin base part, creating a dedicated intermediate reference structure that is optimized for image recognition while maintaining alignment functionality.
Solution Approach 2:
The patent utilizes color or reflectivity changes in the alignment mark structure to improve detectability. The alignment mark is formed with a specific structure on the underfill resin that creates optical contrast, enabling reliable image recognition. This may involve using materials or structures that reflect or absorb light differently from the surrounding areas, making the alignment mark clearly visible to the image recognition system.
2Strength
If underfill resin with low transparency is used, then the structural integrity is maintained, but the alignment mark cannot be clearly image-recognized
Solution Approach 1:
The patent applies local quality by creating a specific region on the underfill resin with different optical properties. The alignment mark is formed on the peripheral edge portion of the underfill resin base part, creating a localized area with enhanced optical characteristics that differ from the bulk underfill resin. This allows the alignment mark to be clearly visible while the rest of the underfill resin maintains its low transparency and structural integrity.
Solution Approach 2:
The alignment mark structure acts as an intermediary that bridges the contradiction between transparency and structural integrity. By positioning the alignment mark on the peripheral edge portion of the underfill resin base part, the patent creates a dedicated interface region that optimizes optical detectability without compromising the overall structural properties of the low transparency underfill resin.
3Quantity of substance
If multiple semiconductor chips are stacked for high density mounting, then the mounting density increases, but the alignment stability between upper and lower chips deteriorates
Solution Approach 1:
The patent segments the alignment function into distinct components: alignment marks on the underfill resin base part, separate from the semiconductor chips themselves. This segmentation allows each chip to be mounted independently while maintaining stable alignment through the standardized alignment mark structure on the underfill resin, enabling reliable multi-chip stacking.
Solution Approach 2:
The patent performs preliminary action by pre-forming the alignment mark structure on the underfill resin base part before chip mounting. This preliminary alignment reference structure is prepared in advance, ensuring that when chips are stacked for high density mounting, the alignment process is stabilized by the pre-established reference marks, reducing alignment variability between upper and lower chips.
Data Source
AI summary
An electronic component device includes a first electronic component, a second electronic component disposed on and connected to the first electronic component, a first underfill resin filled between the first electronic component and the second electronic component, the first underfill resin having a base part arranged around the second electronic component and an alignment mark formed on an upper surface of the base part, a third electronic component disposed on and connected to the second electronic component, and a second underfill resin filled between the second electronic component and the third electronic component.