Underfill Planarization for IC Packaging Warpage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit packaging systems face challenges with local and global planarization inconsistencies in vertically stacked packages, leading to difficulties in the package-to-package stacking assembly process due to irregularities in flatness or planarity, and existing solutions have not effectively addressed these issues.
Innovation Solution
A method involving a substrate with a projection along its perimeter, an integrated circuit mounted over the substrate, and a protruding interconnect formed between the projection and the integrated circuit, with an underfill material deposited between them to a uniform height less than the projection height, which helps in minimizing substrate and package warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If vertically stacked packages are used to increase component density, then the density of components increases and product size decreases, but local and global planarization inconsistencies occur making package-to-package stacking assembly difficult
Solution Approach 1:
An underfill material is introduced as an intermediary substance between the integrated circuit and the substrate. This underfill material fills the gaps and irregularities, acting as a mediator that compensates for planarity issues while maintaining the vertical stacking configuration for high density.
Solution Approach 2:
The physical and chemical parameters of the underfill material are optimized to achieve the desired effect. The material's viscosity, curing characteristics, and mechanical properties are specifically controlled to provide planarization support without compromising the vertical stacking architecture.
2Stability of the object's composition
If underfill material is applied to reduce warpage, then substrate and package warpage is minimized, but the complexity of the manufacturing process increases
Solution Approach 1:
The underfill material is applied in advance during the manufacturing process, before final assembly and testing. This preliminary application of underfill establishes the planar foundation early, preventing warpage development throughout subsequent manufacturing steps and reducing the need for corrective actions later.
Solution Approach 2:
The underfill material provides self-leveling and self-supporting properties that automatically compensate for planarity issues without requiring additional complex manufacturing steps. The material's inherent characteristics enable it to self-adjust and maintain stability, reducing process complexity.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a projection formed along a perimeter of a first surface of the substrate; mounting an integrated circuit over the first surface; forming a protruding interconnect over the first surface between the projection and the integrated circuit; and forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection.