Underlayment Boss Structure for Secure Heating Wire Positioning

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Solution Overview

Problem

Existing in-floor heating systems face challenges in securely locating and maintaining wires or pipes, leading to uneven heating and potential damage, while also requiring efficient bonding of successive flooring layers.

Innovation Solution

A system featuring a base with protrusions, or bosses, that securely position and maintain heating elements, allowing for adhesive interaction between layers and facilitating even heat distribution, with features like ring-shaped bosses and hollow structures for weight reduction and heat regulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If wires are not secured between adjacent studs, then installation is simpler, but heating becomes uneven and wires may be damaged

Engineering Contradiction:
Improveinstallation simplicityVSAvoidheating uniformity and wire protection
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The continuous mat is segmented into discrete sections with individual studs, allowing wires to be secured at specific intervals between studs rather than requiring continuous attachment, thus simplifying installation while maintaining heating uniformity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Studs are pre-positioned on the mat at predetermined locations before wire installation, allowing installers to simply place wires between studs without complex measurement or positioning, achieving both simplicity and reliability

Inventive Principle:
Principle #10Preliminary action

2Ease of operation

If a continuous mat is used, then wire positioning is facilitated, but successive layers of adhesive cannot interact with each other

Engineering Contradiction:
Improvewire positioningVSAvoidadhesive layer interaction
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The continuous mat is replaced with a segmented structure featuring discrete studs on a base, creating gaps between studs that allow adhesive layers to interact while still providing predetermined wire positioning locations

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The base structure with studs acts as an intermediary element that provides wire positioning functionality while simultaneously allowing adhesive penetration and interaction between flooring layers

Inventive Principle:
Principle #24Intermediary (Mediator)

3Loss of energy

If thicker pipes are used in hydronic systems, then heat transfer is improved, but floor thickness increases which is undesirable

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidfloor thickness
Core Design Contradiction:
Loss of energyVSLength of stationary object

Solution Approach 1:

The mechanical hydronic pipe system is replaced with an electric heating cable system that can be installed in a much thinner configuration while achieving comparable or superior heat transfer efficiency

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The heating system parameters are changed from hydraulic (pipe diameter, water flow) to electrical (cable resistance, current), enabling much thinner installation depth while maintaining or improving heat transfer efficiency

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively secures heating elements, ensures even heating, and enhances the bonding of flooring layers, reducing thermal loss and installation complexity, while allowing for efficient water drainage and air permeability.

Implementation Method 1

In-floor and in-wall heating and cooling is well known that utilizes heat conduction and radiant heat

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

In-floor and in-wall heating and cooling is well known that utilizes heat conduction and radiant heat

Methodology Applied
Scientific EffectRadiant heat: Thermal Radiation

Implementation Method 3

The underlayment layer of one embodiment of the present invention is made by vacuum forming, thermal forming, injection molded, blow molded, cast or any other similar forming technique

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9518746B2Method and apparatus for positioning heating elements
Publication Date: 2016.12.13 PROGRESS PROFILES
  • US9518746B2 patent drawing
  • US9518746B2 patent drawing
  • US9518746B2 patent drawing

AI summary

An underlayment system is provided that includes a plurality of bosses that emanate form a common base member. The bosses and bases preferably include an opening therethrough that will allow for subsequent layers of adhesive to interact and bond to each other. The bosses are also spaced in such a way to help secure a wire snugly therebetween.