Unitary Heat Diffusion Element for Compact Die Cooling
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Solution Overview
Problem
The miniaturization of electronic devices leads to increased heat generation, which can damage neighboring circuits and affect the performance of temperature-dependent components without effective heat dissipation solutions.
Innovation Solution
A heat diffusion element made of a thermally-conductive material with a main portion on the die, secondary portions flush with the package surface, and intermediate portions coupling them, forming a unitary body for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of electronic devices is reduced, then the device becomes more compact and portable, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The heat diffusion element extends vertically from the die surface through intermediate portions to secondary portions that reach the package upper surface, utilizing the third dimension (height) to create additional heat dissipation pathways without increasing the horizontal footprint of the device
Solution Approach 2:
The heat diffusion element is divided into distinct functional segments: a main portion in contact with the die, intermediate portions coupling the main and secondary portions, and secondary portions extending to the package surface, allowing each segment to perform its specific heat transfer function efficiently
2Temperature
If cooling systems with higher heat dissipation performance are used, then heat dissipation capacity is improved, but the complexity of the device increases
Solution Approach 1:
The heat diffusion element combines multiple functions into a single integrated structure: thermal conduction from the die, structural support through the package, and heat dissipation at the upper surface, eliminating the need for separate cooling components
Solution Approach 2:
The heat diffusion element serves multiple purposes simultaneously: it acts as a thermal conductor, a structural element within the package, and a heat dissipation surface, making the system more efficient without adding complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation capacity without impacting the die or substrate, improving thermal management and protecting components from thermal degradation.
Implementation Method 1
a heat diffusion element, the heat diffusion element being made of a thermally-conductive material
Data Source
AI summary
An electronic device includes an electronic die in a package and a heat diffusion element. The heat diffusion element is made of a thermally-conductive material and is formed of a single block (unitary body) that includes: a main portion resting on at least a portion of an upper surface of the electronic die; at least one secondary portion flush with an upper surface of the package; and at least one intermediate portion coupling the main portion to the at least one secondary portion.