Universal Mold for Semiconductor Terminal Meshing

Solution Overview

Problem

The existing semiconductor device manufacturing methods require different molds for various semiconductor products, leading to increased costs and decreased production efficiency due to the need for multiple molds and time-consuming mold changes, as the arrangement of main and signal terminals varies across products.

Innovation Solution

A semiconductor device manufacturing method that integrates a substrate, semiconductor element, and terminal aggregate, including signal, main, and dummy terminals, onto a single mold, allowing for resin encapsulation of multiple products using a single mold setup by meshing terminals with mold blocks and injecting mold resin into a cavity formed by the mold halves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If different molds are prepared for different semiconductor device products with varying terminal arrangements, then each product can be manufactured with appropriate terminal configuration, but manufacturing cost increases and production efficiency decreases

Engineering Contradiction:

Improveterminal arrangement adaptabilityVSAvoidproduction efficiency

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The mold is designed with a universal structure that can accommodate multiple semiconductor device products with different terminal arrangements. The mold includes a cavity and multiple positioning structures (first positioning structures for signal terminals and second positioning structures for main terminals) that can be configured in various patterns. This allows a single mold to serve multiple product types, eliminating the need for dedicated molds for each product variant and thereby improving production efficiency while maintaining adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If different molds are prepared for different semiconductor device products, then each product achieves optimal terminal configuration, but manufacturing cost increases

Engineering Contradiction:

Improveterminal arrangement adaptabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The mold is designed with a universal structure that can accommodate multiple semiconductor device products with different terminal arrangements. The mold includes a cavity and multiple positioning structures (first positioning structures for signal terminals and second positioning structures for main terminals) that can be configured in various patterns. This allows a single mold to serve multiple product types, eliminating the need for dedicated molds for each product variant and thereby improving production efficiency while maintaining adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If molds are changed frequently to accommodate different semiconductor device products, then each product is manufactured with correct terminal arrangement, but production time increases

Engineering Contradiction:

Improveterminal arrangement adaptabilityVSAvoidmold change time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The mold is designed with a universal structure that can accommodate multiple semiconductor device products with different terminal arrangements. The mold includes a cavity and multiple positioning structures (first positioning structures for signal terminals and second positioning structures for main terminals) that can be configured in various patterns. This allows a single mold to serve multiple product types, eliminating the need for dedicated molds for each product variant and thereby improving production efficiency while maintaining adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The positioning structures (first positioning structures and second positioning structures) are pre-configured in the mold in specific patterns. This preliminary arrangement of positioning structures allows for quick adaptation to different product types without requiring mold changes or complex setup procedures during production, thereby reducing the time loss associated with mold changes.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9472538B2Semiconductor device manufacturing method and semiconductor device

Publication Date: 2016.10.18 MITSUBISHI ELECTRIC CORP

AI summary

Fixing a semiconductor element to a substrate, electrically connecting signal and main terminals to the semiconductor element, a terminal aggregate includes a frame portion, the signal terminal, the main terminal, which has a larger width than the signal terminal, and a dummy terminal, and forming a to-be-encapsulated body in which the substrate, the semiconductor element, and the terminal aggregate are integrated, mounting the to-be-encapsulated body on a lower mold half such that a plurality of blocks formed in the lower mold half are meshed with the signal, main, and dummy terminals with no space left therebetween after the mounting, placing a bottom surface of an upper mold half on top surfaces of the plurality of blocks, and top surfaces of the signal, main, and dummy terminals to form a cavity for the substrate and the semiconductor element, and performing molding by injecting mold resin into the cavity are included.