Electrostatic Chuck Voltage Adjustment for Upper Electrode Wear

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In plasma processing apparatuses, the adhesiveness between the upper electrode and the cooling plate degrades due to the consumption of the upper electrode, leading to insufficient heat removal and temperature increase, which deteriorates processing characteristics.

Innovation Solution

A power supply controller adjusts the absolute voltage applied to the electrostatic chuck based on the degree of upper electrode consumption, increasing the attraction force to maintain adhesiveness and efficient heat removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a fixed voltage is applied to the electrostatic chuck, then the upper electrode is attracted to the cooling plate, but the adhesiveness deteriorates due to upper electrode consumption

Engineering Contradiction:
Improveadhesiveness between upper electrode and cooling plateVSAvoidservice life of upper electrode
Core Design Contradiction:
ReliabilityVSDuration of action of moving object

Solution Approach 1:

The voltage applied to the electrostatic chuck is made variable rather than fixed. The power supply controller dynamically adjusts the voltage based on the consumption degree of the upper electrode, increasing the voltage as the electrode consumes to maintain constant attraction force and adhesiveness throughout the electrode's service life.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system implements feedback control where the power supply controller monitors the consumption degree of the upper electrode and adjusts the voltage accordingly. This closed-loop control ensures that the attraction force remains sufficient even as the electrode deteriorates over time.

Inventive Principle:
Principle #23Feedback

2Duration of action of moving object

If the upper electrode is consumed, then the processing time increases, but the heat removal efficiency decreases due to reduced adhesiveness

Engineering Contradiction:
Improveprocessing timeVSAvoidtemperature of upper electrode
Core Design Contradiction:
Duration of action of moving objectVSTemperature

Solution Approach 1:

The voltage to the electrostatic chuck is dynamically adjusted based on electrode consumption. By increasing the voltage as the electrode consumes, the system maintains strong adhesiveness between the electrode and cooling plate, ensuring continuous efficient heat removal throughout the extended processing time.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The power supply controller proactively increases the voltage before significant temperature rise occurs by monitoring electrode consumption. This preliminary adjustment prevents heat accumulation by maintaining optimal thermal contact between the electrode and cooling plate throughout the processing cycle.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively suppresses the deterioration of adhesiveness and heat removal efficiency, improving plasma processing characteristics by enhancing the attraction force and maintaining stable temperature control.

Implementation Method 1

an electrostatic chuck provided between the cooling plate and the upper electrode and configured to attract the upper electrode

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

the upper electrode is fixed to a cooling plate having a cooling device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11825589B2Plasma processing apparatus and plasma processing method
Publication Date: 2023.11.21 TOKYO ELECTRON LTD
  • US11825589B2 patent drawing
  • US11825589B2 patent drawing
  • US11825589B2 patent drawing

AI summary

A plasma processing apparatus includes a cooling plate having a fixing surface to which an upper electrode is fixed, the cooling plate having, on the fixing surface, an electrostatic chuck configured to attract the upper electrode by an attraction force generated by an applied voltage; a power supply configured to apply the voltage to the electrostatic chuck; and a power supply controller configured to control the power supply such that an absolute value of the voltage applied to the electrostatic chuck is increased based on a degree of consumption of the upper electrode.