Upper Passivation Film Protects Thin Film Encapsulation During Panel Cutting
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Solution Overview
Problem
Existing display panel manufacturing processes face challenges in protecting the thin film encapsulation layer from damage during cutting and subsequent processes, leading to defects such as dark spots and reduced yield.
Innovation Solution
A method involving the attachment of an upper passivation film to the thin film encapsulation layer, which includes a carrier film, adhesive layer, and release film, to prevent damage during cutting and subsequent processes, allowing for the removal of the release film and attachment of the adhesive layer to the encapsulation layer, and subsequent attachment of a functional layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the thin film encapsulation layer is directly exposed during cutting and subsequent processes, then the manufacturing process is simpler, but the thin film encapsulation layer is damaged causing defects and reduced yield
Solution Approach 1:
An upper passivation film is formed on the thin film encapsulation layer before cutting and subsequent manufacturing processes. This preliminary protective action prevents damage to the thin film encapsulation layer during handling, cutting, and assembly operations, thereby maintaining layer integrity while enabling standard manufacturing procedures
Solution Approach 2:
The upper passivation film serves as an intermediary protective layer between external mechanical stresses and the thin film encapsulation layer. This mediator absorbs and distributes stress during cutting and handling, preventing direct damage to the fragile thin film encapsulation layer while allowing the manufacturing process to proceed
2Reliability
If the upper passivation film is kept on the thin film encapsulation layer throughout all processes, then the thin film encapsulation layer is protected, but subsequent attachment of functional layers becomes difficult
Solution Approach 1:
The upper passivation film is formed preliminarily to protect the thin film encapsulation layer during cutting and handling. After these critical protective phases are complete, the passivation film is selectively removed from specific regions to enable subsequent functional layer attachment, thus serving its protective purpose temporarily and then being discarded
Solution Approach 2:
The upper passivation film is discarded after it has served its protective function during cutting and handling. By removing the passivation film from specific regions after the critical protective phase, the system recovers the ability to attach functional layers while the thin film encapsulation layer remains intact and protected
3Reliability
If protection films are attached to both substrates before cutting, then damage during cutting is prevented, but the process complexity and number of steps increase
Solution Approach 1:
The protective function is extracted and consolidated into a single upper passivation film formed only on the thin film encapsulation layer side, rather than requiring separate protection films on both substrates. This extraction reduces the total number of protection films and process steps while maintaining adequate protection during cutting operations
Solution Approach 2:
The upper passivation film serves multiple functions: it protects the thin film encapsulation layer during cutting, provides a temporary protective barrier during subsequent handling, and can be selectively removed to enable functional layer attachment. This multi-functionality reduces the need for multiple separate protection films and process steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively protects the thin film encapsulation layer from damage, reduces defects, and increases the degree of freedom in display panel structure by allowing for the attachment of functional layers like polarizers or touch screen panels post-cutting, enhancing productivity and yield.
Implementation Method 1
attaching an upper passivation film to the mother panel... The upper passivation film may initially include a carrier film, an adhesive layer formed on a lower portion of the carrier film
Data Source
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AI summary
A method of manufacturing a display panel includes forming a mother panel on a base substrate, attaching an upper passivation film to the mother panel, detaching the base substrate from the mother panel, attaching a lower film to the mother panel, and cutting the mother panel to which the upper passivation film and the lower film are attached to form the display panel, the display panel being in a form of a cell unit. The display panel includes a display substrate, a display device layer, and a thin film encapsulation layer.