Non-Pneumatic Tire Tread Curing on Upper Ring Ledges

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Solution Overview

Problem

Existing methods for applying a tread to non-pneumatic tire structures often rely on adhesives, which may not provide a strong or durable bond, and do not efficiently utilize the structural geometry of the tire.

Innovation Solution

A method and system for applying an elastomeric tread to a non-pneumatic tire structure, where the tread is secured using a curing envelope that is sealed to the tire's upper ring ledges without the use of pressure-sensitive adhesive, and heat is applied within the envelope to bond the tread to the ring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive or cement is used to adhere the tread to the upper ring, then the tread can be attached to the tire structure, but the bond strength and durability are insufficient

Engineering Contradiction:
Improvebond strengthVSAvoiddurability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent replaces the chemical bonding system (adhesive/cement) with a thermal bonding system. The curing envelope creates a sealed environment where heat can be applied uniformly to bond the tread to the upper ring, eliminating reliance on adhesive materials and their associated strength and durability limitations.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding parameter from chemical (adhesive-based) to thermal (heat-based). By controlling temperature within the curing envelope, the tread material itself becomes the bonding agent, achieving superior bond strength and durability through thermally-induced molecular bonding rather than adhesive bonding.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If the support structure width is reduced to create ledges, then the structural geometry is optimized for tread application, but the support structure becomes more complex to manufacture

Engineering Contradiction:
Improvetread application processVSAvoidsupport structure geometry
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent incorporates ledge features into the upper ring design before tread application. These ledges are pre-formed structural elements that facilitate subsequent tread installation by providing attachment surfaces for the curing envelope, making the overall manufacturing process easier despite the added geometric complexity.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the bond strength between the tread and the tire, improves durability, and optimizes the use of the tire's structural geometry, resulting in a more reliable and efficient tread application process.

Implementation Method 1

applying heat within the curing envelope

Methodology Applied
Scientific EffectHeat: Heating

Data Source

PatentUS20250033416A1Non-pneumatic tire and a system and method of making same
Publication Date: 2025.01.30 BRIDGESTONE BANDAG LLC
  • US20250033416A1 patent drawing
  • US20250033416A1 patent drawing
  • US20250033416A1 patent drawing

AI summary

A system for assembling a tread and a non-pneumatic tire structure includes a curing envelope dimensioned to receive an upper ring of a non-pneumatic tire structure and a circumferential tread. The curing envelope includes a first side configured to be secured to a bottom of a first ledge of the upper ring. The curing envelope also includes a second side configured to be secured to a bottom of a second ledge of the upper ring. The system further includes a first fastener configured to secure the first side of the curing envelope to the bottom of the first ledge of the upper ring. The system also includes a second fastener configured to secure the second side of the curing envelope to the bottom of the second ledge of the upper ring.