Package Substrate Dividing with UV-Reduced Adhesive Tape
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Solution Overview
Problem
The existing methods for dividing package substrates with resin-sealed devices are inefficient, leading to reduced productivity due to the hindrance caused by the marginal portion during the peeling process, especially when the size of each device package is small and the number of division lines is large.
Innovation Solution
A package substrate dividing method using ultraviolet curing adhesive tape, where ultraviolet light is applied to reduce the adhesive force of the tape in specific areas, allowing for partial peeling and scattering of the marginal portion during cutting, thereby eliminating the need for manual pickup and maintaining high productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the marginal portion is preliminarily picked up and removed from the adhesive tape before picking up the device packages, then the operation hindrance is eliminated, but much time is required for the pickup of the marginal portion, causing a reduction in productivity
Solution Approach 1:
The adhesive tape is preliminarily subjected to ultraviolet light irradiation to reduce its adhesive force in the marginal portion area before the dividing operation. This preliminary action modifies the adhesive properties in advance, allowing the marginal portion to be easily scattered and removed during the subsequent dividing step without requiring separate pickup operations, thus maintaining high productivity while ensuring smooth operation
Solution Approach 2:
The adhesive force of the adhesive tape is changed by applying ultraviolet light, which alters the physical-chemical state of the adhesive material. This parameter change reduces the adhesive force in the marginal portion area, enabling easy separation and scattering of the marginal portion during cutting without manual intervention, thereby resolving the contradiction between operational smoothness and productivity
2Adaptability or versatility
If an annular frame is fixed to the peripheral portion of the adhesive tape, then different kinds of package substrates can be divided without changing the cutting apparatus configuration, but the device complexity increases
Solution Approach 1:
Instead of using a universal annular frame structure, the invention applies local quality changes by selectively irradiating ultraviolet light to specific areas (marginal portion) of the adhesive tape. This creates area-specific adhesive force reduction, achieving versatile adaptability for different package substrates through localized property modification rather than structural complexity
Solution Approach 2:
The mechanical annular frame structure is replaced by a light-based system. Ultraviolet light irradiation substitutes for the mechanical frame, achieving the same function of marking and preparing the marginal portion for separation without adding mechanical complexity to the cutting apparatus
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the adhesive force of the tape, allowing for efficient division and peeling of device packages without manual intervention, thereby maintaining high productivity even with small device packages and numerous division lines.
Implementation Method 1
a first ultraviolet light applying step of applying ultraviolet light to the adhesive tape in a condition where a first area of the adhesive tape corresponding to the marginal portion is exposed
Data Source
AI summary
A package substrate is divided into a plurality of device packages. An adhesive tape is attached to a back side of the substrate by cutting the substrate along a plurality of division lines formed on a front side of the substrate. The substrate includes a device portion partitioned into a plurality of device package regions by the division lines, and a marginal portion surrounding the device portion. A first ultraviolet light is applied to reduce the adhesive force of the adhesive tape in the marginal portion. The adhesive tape is partially peeled from the substrate in the marginal portion, and the substrate is cut along each division line by using a cutting blade to thereby divide the substrate into the device packages. In the dividing step, the marginal portion separated from the substrate is scattered by rotation of the cutting blade and thereby removed from the adhesive tape.