UV-Cure Conductive Adhesive for Encapsulated Test Point Probing
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Solution Overview
Problem
Conventional soldering techniques for attaching test probes to devices under test are challenging due to high temperatures, risk of damage, and difficulty in achieving short wire lengths, especially with shrinking device geometries, leading to inefficient and damaging attachment processes.
Innovation Solution
The use of a UV-cure conductive adhesive that is cured using ultraviolet light, allowing for quick and easy attachment of test probes to device under test without the need for high heat, and enabling short wire lengths for optimal electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional soldering techniques are used to attach test probes to devices under test, then mechanical strength of the connection is improved, but the risk of damaging components increases due to high temperatures
Solution Approach 1:
The patent changes the temperature parameter from high (soldering at 700°F+) to low (UV-curing at room or slightly elevated temperature). The adhesive bonding process operates at temperatures below 200°F, eliminating thermal damage to sensitive electronic components while maintaining connection strength through chemical adhesion rather than metallurgical bonding
Solution Approach 2:
The patent replaces the thermal-mechanical soldering system with a photochemical adhesive bonding system. Instead of using heat and pressure to melt and solidify solder, the invention uses UV light to initiate polymerization and curing of the adhesive, creating a strong mechanical and electrical connection without thermal exposure
2Reliability
If soldering is used to attach probe tips directly to test points, then electrical connection is achieved, but the ability to achieve short wire lengths is reduced due to difficulty in precise alignment
Solution Approach 1:
The patent applies preliminary action by pre-positioning the adhesive on the probe tip or test point before final assembly. The adhesive is applied in a controlled manner prior to UV curing, allowing precise placement and alignment to be established before the bonding process begins, ensuring minimal wire length and optimal electrical connection
Solution Approach 2:
The patent changes the bonding mechanism from thermal (soldering) to photochemical (UV-curing adhesive). This allows for lower operating temperatures and more precise control over the bonding process, enabling better alignment precision and shorter wire lengths while maintaining reliable electrical connection
3Strength
If conventional soldering techniques are used, then permanent attachment is achieved, but ease of removal and rework is worsened
Solution Approach 1:
The patent enables easy removal and recovery of the adhesive bonding. The UV-cured adhesive can be removed using standard solvents or heat, allowing probe tips to be detached and reused. This recovers both the probe tip and the test point on the device, enabling rework and repeated testing operations without permanent damage
Solution Approach 2:
The patent introduces dynamic reversibility to the attachment process. While the UV-cured adhesive provides strong permanent bonding during normal operation, the bond can be easily broken and reformed as needed. This dynamic characteristic allows the attachment to transition between permanent and removable states, facilitating repair and rework operations
4Strength
If high temperature soldering is used to ensure strong bonding, then bonding strength is improved, but the complexity of the process increases due to temperature control requirements
Solution Approach 1:
The patent replaces the complex thermal-mechanical soldering system with a simpler photochemical adhesive bonding system. The UV-curing process requires only light exposure and minimal pressure, eliminating the need for temperature control equipment, soldering irons, and associated safety infrastructure, thereby reducing overall process complexity while maintaining bonding strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method eliminates the need for high-temperature soldering, reduces the risk of damaging components, facilitates easier attachment and removal, and improves electrical performance by allowing for shorter wire lengths and precise alignment, while also adhering to non-metallic surfaces, thus enhancing the reliability and accuracy of measurements.
Implementation Method 1
a UV-cure conductive adhesive that is cured using ultraviolet light
Data Source
AI summary
A method for acquiring a signal from an encapsulated test point on a device under test, includes forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point, delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point, applying UV light from a UV light source to cure the delivered adhesive, and connecting a conductive element between the cured adhesive and a test and measurement instrument.