UV LED Package Thermal Management via Ceramic Cavity and Buffer Layer
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Solution Overview
Problem
UV LEDs generate heat during operation, leading to reliability issues and making it difficult to create highly integrated and economical light emitting device packages that effectively dissipate heat while maintaining light extraction efficiency.
Innovation Solution
A light emitting device package design featuring a ceramic body with a cavity, a heat dissipation member between the body and the LED, and a buffer layer to enhance heat dissipation and protect the LED, along with sub-cavities to distribute heat and prevent moisture permeation, allowing for efficient heat management and protection of the UV LED.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the package size is increased to dissipate heat, then heat dissipation efficiency is improved, but integration density and economic viability deteriorate
Solution Approach 1:
The package is divided into multiple functional layers including a substrate, heat dissipation member, buffer layer, and LED chip mounted in a cavity. This segmentation allows each component to be optimized independently for its specific function while maintaining overall compactness.
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional vertical heat dissipation by stacking components in layers. The heat dissipation member extends vertically beneath the LED chip, and the buffer layer provides additional thermal management in the vertical dimension, enabling effective heat dissipation without increasing package footprint.
2Temperature
If a heat dissipation member is added to improve heat dissipation, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat dissipation member is merged with the substrate structure, forming an integrated thermal management system. The buffer layer is also integrated into the stacking sequence between the heat dissipation member and LED chip, combining multiple functions (thermal management, mechanical support, stress relief) into a unified structure rather than adding separate discrete components.
3Reliability
If the package structure is optimized for heat dissipation, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The cavity is pre-formed in the substrate before mounting the LED chip, and the heat dissipation member and buffer layer are pre-positioned in the stacking sequence. This preliminary structuring simplifies the subsequent assembly process by providing predetermined locations for component placement and reducing the need for complex post-assembly adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation efficiency, maintains light extraction efficiency, and ensures thermal stability and reliability of the UV LED package, enabling the use of UV LEDs with various wavelengths without the need for different package structures.
Implementation Method 1
a heat dissipation member between a bottom surface of the cavity and a lower surface of the body
Implementation Method 2
a buffer layer disposed between the heat dissipation member and at least one of the pads
Data Source
AI summary
Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member.