UV LED Package Reflective Housing Using Composite Silicone and Inorganic Fillers
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Solution Overview
Problem
The high material and manufacturing costs of UV LED package structures, particularly due to the use of ceramic substrates and glass or ceramic reflective housings, which are time-consuming and expensive, while also requiring UV-resistant materials to withstand long-time UV irradiation.
Innovation Solution
A UV LED package structure utilizing a silicone molding compound with an inorganic filler having a wide energy gap as the reflective housing, which reduces manufacturing costs and improves light reflectivity by selecting a suitable energy gap for the desired UV wavelength, allowing for better performance and easier production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic substrate and glass or ceramic reflective housing are used in UV LED package structure, then UV resistance and light reflectivity are improved, but manufacturing cost and production time increase
Solution Approach 1:
The patent uses a composite material consisting of silicone resin combined with UV-resistant inorganic fillers (such as alumina, silica, or titania) to create a reflective housing that simultaneously provides UV resistance, light reflectivity, and cost-effectiveness. This composite approach replaces expensive pure ceramic materials while maintaining the required performance characteristics.
Solution Approach 2:
The patent modifies the material composition parameters by adjusting the types and proportions of inorganic fillers in the silicone resin matrix. By selecting fillers with appropriate refractive indices and UV absorption characteristics, the material achieves optimal UV resistance and light reflectivity at lower manufacturing costs compared to traditional ceramic materials.
2Reliability
If ceramic substrate and glass or ceramic reflective housing are used in UV LED package structure, then UV resistance and light reflectivity are improved, but production time increases
Solution Approach 1:
The silicone-based composite material can be processed using conventional molding techniques at lower temperatures compared to ceramic sintering processes. This significantly reduces production time while maintaining UV resistance through the inorganic filler components.
Solution Approach 2:
The patent replaces the complex, time-consuming ceramic sintering process with a simpler silicone molding process. The inorganic fillers provide the necessary UV resistance without requiring high-temperature ceramic processing, thus reducing production time and increasing productivity.
3Ease of manufacture
If silicone molding compound with inorganic filler is used as reflective housing, then manufacturing cost is reduced, but UV resistance must be maintained
Solution Approach 1:
The silicone resin is combined with UV-resistant inorganic fillers (alumina, silica, titania) to create a composite material that maintains UV resistance. The inorganic fillers absorb and scatter UV radiation, protecting the LED package while the silicone matrix provides the molding flexibility and cost advantages.
Solution Approach 2:
The inorganic fillers act as intermediary substances that absorb UV radiation and protect the silicone resin matrix from degradation. This allows the material to maintain UV resistance at lower costs compared to pure ceramic materials, as the fillers are more cost-effective while performing the protective function.
4Ease of manufacture
If silicone molding compound with inorganic filler is used as reflective housing, then manufacturing cost is reduced, but light reflectivity in UV wavebands must be improved
Solution Approach 1:
The patent optimizes the refractive index parameters of the inorganic fillers to enhance light reflectivity. By selecting fillers with refractive indices that create optimal optical contrast with the silicone matrix, the composite material achieves high UV light reflectivity while maintaining cost-effectiveness.
Solution Approach 2:
The combination of silicone resin with specific inorganic fillers creates a composite material with enhanced optical properties. The fillers provide both UV resistance and high reflectivity through their optical characteristics, achieving dual functionality at lower cost than traditional ceramic reflective housings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves high light reflectivity in UV wavebands with a lower cost, providing a more efficient and cost-effective UV LED package structure by using a silicone molding compound with inorganic fillers, such as silicon dioxide or boron nitride, which maintains UV resistance and enhances light extraction efficiency.
Implementation Method 1
A high light reflectivity in UV wavebands of the UV LED package structure can be provided by using a silicone molding compound and a filler mixed therewith as a reflective housing
Implementation Method 2
an inorganic material with a wide energy gap mixed with a silicone molding compound (a resin material) is chosen to be a reflective housing of the LED package structure
Data Source
AI summary
An LED package structure includes a conductive frame assembly, a reflective housing, an UV LED chip disposed on the conductive frame assembly, and a die-attach adhesive for bonding the UV LED chip to the conductive frame assembly. The reflective housing includes Silicone Molding Compound (SMC) and filler mixed in the SMC. The energy gap of the filler is greater than or equal to 4 eV. The energy gap of the filler thereof can be chosen by the following formulas. When the refractive index difference between the filler and the SMC is less than or equal to 0.2, the energy gap of the filler is satisfied the following formula. E≥1240 (nm·eV)/(λ−150(nm)). When the refractive index difference between the filler and the SMC is greater than 0.2, the energy gap of the filler is satisfied the following formula. E≥1240(nm·eV)/(λ−50(nm)).