UV LED Sapphire Substrate Heat Dissipation

The patent transitions from conventional cylindrical or rectangular LED arrangements to a planar array configuration where multiple LEDs are mounted on a flat substrate. This dimensional change enables superior heat extraction through the substrate while maintaining high UV power density through optimized LED spacing and orientation, achieving both structural simplicity and high performance.

The patent eliminates the epoxy encapsulation layer entirely, exposing the LED chips and their mounting structure directly to the environment. This extraction of the degrading component resolves the contradiction by removing the source of time-dependent degradation while the LEDs remain protected by their robust semiconductor structure and mounting configuration, significantly extending operational lifespan under UV radiation.

The patent merges the LED mounting structure with a thermally conductive substrate that eliminates air gaps between LEDs and the heat-sinking surface. This integration combines the electrical mounting function with thermal management, creating a unified structure that simultaneously simplifies assembly and maximizes heat dissipation efficiency through direct thermal contact.

The patent changes the power density parameter from conventional levels (∼1 mW/cm²) to significantly higher levels by implementing a dense array configuration with multiple high-power LEDs operating in parallel. This parameter change maintains device safety through distributed thermal management while achieving the high UV power densities necessary for effective disinfection and increased flow rates.