UV-Curable Resin Composition for Stable Wafer Backgrinding Adhesion
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Solution Overview
Problem
Conventional pressure-sensitive adhesive films used in semiconductor wafer backgrinding struggle to absorb the roughness of large bumps on the wafer surface, leading to grinding unevenness and limited adhesion performance over time due to changes in the dispersion state of polymer and tackifier in ultraviolet curable liquid resin compositions.
Innovation Solution
An ultraviolet curable resin composition comprising a monomer or oligomer with a polymerizable unsaturated double bond, a photopolymerization initiator, and an acid with an acid dissociation constant of 4.0 or less, which maintains adhesion force even after long-term storage by suppressing changes in the dispersion state and providing improved viscosity and adhesion properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the viscosity of the resin composition is increased to suppress variation in dispersion state during storage, then storage stability is improved, but difficulty in feeding the resin composition through pipes increases
Solution Approach 1:
The patent applies parameter changes by carefully controlling the viscosity of the resin composition within a specific range (50-5000 mPa·s at 25°C) and adjusting the content of the acid (0.01-5% by weight) to achieve optimal balance between storage stability and feedability. This quantitative parameter optimization resolves the contradiction between maintaining dispersion stability and ensuring ease of feeding through pipes.
2Device complexity
If a conventional pressure-sensitive adhesive film is used, then the structure is simple, but the roughness absorption capability is limited when dealing with large bumps
Solution Approach 1:
The patent employs composite materials by formulating a resin composition containing multiple components: polymerizable compound, photopolymerization initiator, and specific acid (with pKa ≤ 4.0). This composite formulation provides both the simplicity of a single liquid application layer and the advanced functionality of roughness absorption through controlled polymerization, resolving the contradiction between structural simplicity and manufacturing precision.
3Ease of operation
If the resin composition is stored for a long period in liquid state, then application flexibility is maintained, but the dispersion state of polymer and tackifier varies leading to reduced adhesion force
Solution Approach 1:
The patent applies preliminary anti-action by incorporating a specific acid (with pKa ≤ 4.0) into the resin composition before storage. This acid preliminarily counteracts the tendency of polymer and tackifier to aggregate during long-term storage, maintaining uniform dispersion and ensuring that adhesion force is preserved when the composition is eventually applied and cured, thus resolving the contradiction between application flexibility and adhesion strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high adhesion force and stability over time, reducing grinding unevenness and unintended peeling, while allowing for uniform pressure distribution and easy application, even after prolonged storage.
Implementation Method 1
An ultraviolet curable resin composition comprising: a monomer and/or an oligomer having a polymerizable unsaturated double bond; a photopolymerization initiator; and an acid having an acid dissociation constant (pKa1) in pure water of 4.0 or less
Data Source
AI summary
An ultraviolet curable resin composition containing: a monomer and/or an oligomer having a polymerizable unsaturated double bond; a photopolymerization initiator; and an acid having an acid dissociation constant (pKa1) in pure water of 4.0 or less.