Substrate Processing Apparatus UV Irradiation for Low-Temperature Deposition
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Solution Overview
Problem
In substrate processing, achieving the right temperature for deposition while avoiding damage to temperature-sensitive features is challenging, as high temperatures are required for productivity and reactivity but must be kept low to prevent damage.
Innovation Solution
A substrate processing apparatus that includes an illumination system to irradiate ultraviolet radiation within a specific range onto the top surface of substrates from the side, providing energy without overheating, allowing for increased reactivity and better layer quality without damaging temperature-sensitive features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high temperature is applied to increase reactivity and productivity, then deposition rate and layer quality improve, but temperature-sensitive features on the substrate may be damaged
Solution Approach 1:
The patent replaces thermal energy input with ultraviolet irradiation to activate the deposition process. Instead of heating the substrate to high temperatures to increase reactivity, UV radiation provides the necessary energy to initiate and enhance chemical vapor deposition at lower temperatures, thereby maintaining productivity while protecting temperature-sensitive features from thermal damage
Solution Approach 2:
The patent changes the energy input parameter from thermal energy (temperature) to electromagnetic energy (ultraviolet radiation). By introducing UV irradiation in the range of 100-500 nm, the process activates surface reactions and enhances deposition rate without relying on high substrate temperature, thus resolving the contradiction between reactivity and thermal damage risk
2Manufacturing precision
If high temperature is used to enhance reactivity, then layer deposition quality improves, but the substrate temperature must be kept low to avoid damaging sensitive features
Solution Approach 1:
The patent substitutes thermal activation with photonic activation using ultraviolet radiation. The UV light provides the energy needed for high-quality layer deposition through photochemical reactions on the substrate surface, eliminating the need to heat the substrate to high temperatures and thus maintaining low substrate temperature while achieving excellent layer quality
Solution Approach 2:
The patent employs periodic or pulsed ultraviolet irradiation to enhance deposition quality. By controlling the UV radiation in a periodic manner, the process achieves high reactivity and layer quality during irradiation periods while allowing temperature management during non-irradiation periods, thus decoupling quality achievement from continuous high temperature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reactivity of the substrate surface, improving the quality and productivity of deposited layers while allowing processes to be performed at temperatures that were previously not possible due to zero reactivity, without overheating sensitive features.
Implementation Method 1
an illumination system constructed and arranged to irradiate ultraviolet radiation within a range from 100 to 500 nanometers onto a top surface of at least one of the substrates
Data Source
AI summary
The invention relates to a substrate processing apparatus comprising a reaction chamber provided with a substrate rack for holding a plurality of substrates in the reaction chamber. The substrate rack may have a plurality of spaced apart substrate holding provisions configured to hold the plurality of substrates. The apparatus may have an illumination system constructed and arranged to irradiate radiation with a range from 100 to 500 nanometers onto a top surface of the substrates.