UV-Irradiating Wafer Transfer Blade for Faster CMP on Hydrophobic Films

The patent applies preliminary action by performing ultraviolet light irradiation on the wafer surface before the polishing process. The transfer arm includes a light irradiation unit that emits ultraviolet light to the wafer while it is held on the blade, creating hydrophilic treatment in advance. This preliminary hydrophilic treatment ensures that when the wafer enters the polishing process, the surface is already optimized for high-speed polishing, thereby resolving the contradiction between polishing speed and hydrophilic treatment effectiveness.

The patent applies merging by integrating the light irradiation unit directly into the transfer arm structure. The transfer arm now performs dual functions: transferring the wafer to the polishing position and simultaneously irradiating ultraviolet light to the wafer surface. This combination of functions increases hydrophilic treatment effectiveness while minimizing the increase in device complexity, as the light irradiation system is incorporated within the existing transfer arm framework rather than being a completely separate system.

The patent applies universality by designing the transfer arm to perform multiple functions: mechanical transfer of the wafer and optical irradiation for hydrophilic treatment. The light irradiation unit is positioned on the blade such that it can irradiate the wafer during the transfer process without requiring separate dedicated equipment. This multi-functional design enhances hydrophilic treatment effectiveness while controlling device complexity by making the transfer arm itself a universal tool for both transfer and treatment operations.