Vacuum Transfer Chamber Purge Layout for Uniform Particle Removal
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Solution Overview
Problem
In substrate processing apparatuses, the non-uniform air flow of purge gases in vacuum transfer chambers can lead to the accumulation of particles, particularly due to residual gases reacting with moisture, resulting in condensed particles.
Innovation Solution
The substrate processing apparatus includes a vacuum transfer chamber with strategically placed gas ports and exhaust ports, where the purge gas is supplied from the top surface near the second side surface and exhausted from the bottom surface near the first side surface, ensuring a uniform air flow and preventing gas retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If purge gas is supplied from a side of the vacuum transfer chamber opposite to the load lock module side, then particles can be discharged from the exhaust port, but non-uniform air flow causes gas retention and particle accumulation
Solution Approach 1:
The vacuum transfer chamber is divided into multiple regions with gas ports distributed across different surfaces (top, bottom, and side surfaces). This segmentation of the gas supply system creates multiple localized flow sources that collectively achieve uniform air flow throughout the chamber, preventing dead zones where particles could accumulate.
Solution Approach 2:
Gas ports are strategically positioned at specific locations on the chamber surfaces to create locally optimized flow patterns. The distribution of gas ports across multiple surfaces ensures that each region of the chamber receives appropriate purge gas flow, eliminating areas of non-uniform flow and gas retention.
2Object-generated harmful factors
If purge gas flow rate is increased to prevent particle accumulation, then particle discharge improves, but gas consumption and system stress increase
Solution Approach 1:
The total purge gas flow is divided into multiple streams through distributed gas ports. This allows the system to achieve effective particle discharge across the entire chamber volume without requiring excessively high flow rates at any single point, thereby reducing overall gas consumption while maintaining effective particle removal.
Solution Approach 2:
Instead of applying high purge gas flow uniformly across the entire chamber, the system uses multiple gas ports to deliver partial flows to specific regions. This partial action approach achieves sufficient particle discharge efficiency without the excessive gas consumption that would result from uniformly high flow rates throughout the chamber.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the accumulation of particles by ensuring a uniform purge gas flow and preventing residual gases from remaining in the vacuum transfer chamber, thereby enhancing the cleanliness and efficiency of the substrate processing.
Implementation Method 1
one or more exhaust ports provided in the bottom surface in the vicinity of the first side surface of the vacuum transfer chamber and to which an exhaust pump configured to exhaust the purge gas supplied into the vacuum transfer chamber is connected
Data Source
AI summary
A substrate processing apparatus is disclosed. The apparatus comprises a vacuum transfer chamber including a top surface, a bottom surface, and side surfaces between the top and the bottom surfaces, including a first side surface and a second side surface opposite to the first side surface; a transfer robot, disposed in the vacuum transfer chamber, for transferring a substrate; a load lock module connected to the first side surface; a pipe, connected to a purge gas supply source, for supplying a purge gas into the vacuum transfer chamber; one or more gas ports provided in the top surface in the vicinity of the second side surface and connected to the pipe; and one or more exhaust ports, provided in the bottom surface in the vicinity of the first side surface, to which an exhaust pump for exhausting the purge gas supplied into the vacuum transfer chamber is connected.