Vacuum Processing Chamber Segmentation for Wafer Maintenance
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Solution Overview
Problem
Vacuum processing apparatuses face challenges in maintaining uniform processing and efficient maintenance, especially with larger semiconductor wafers, due to increased part size and weight, which complicates manual handling and cleaning, leading to inefficiencies and contamination risks.
Innovation Solution
The design incorporates a vacuum processing apparatus with a circularly shaped processing chamber, axial symmetry support beams, swappable parts for regular maintenance, and a rotating lifter for easy extraction of maintenance units, ensuring uniform gas flow and efficient access for cleaning and replacement of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the diameter of the semiconductor wafer is increased, then the processing capacity is improved, but the size and weight of the apparatus and parts increase, making maintenance difficult
Solution Approach 1:
The processing chamber is divided into an upper chamber and a lower chamber that can be independently removed. The upper chamber includes the discharge electrode and upper container, while the lower chamber includes the lower container and support structure. This segmentation allows each chamber to be separately accessed for maintenance without requiring complete disassembly of the entire apparatus, solving the accessibility problem while supporting larger wafers.
Solution Approach 2:
The upper chamber is designed to be movable relative to the lower chamber through a lifting mechanism. The upper chamber can be lifted upward to separate from the lower chamber, enabling dynamic access to both chambers for maintenance. This dynamic design allows maintenance personnel to easily access and clean reaction products from both upper and lower chambers without difficulty, even when processing large-diameter wafers.
2Quantity of substance
If parts are made larger to accommodate bigger wafers, then the processing capacity is improved, but the time required for maintenance increases
Solution Approach 1:
By segmenting the processing chamber into independently removable upper and lower chambers, maintenance personnel can quickly access and clean each chamber separately. This eliminates the need to disassemble the entire apparatus for maintenance, significantly reducing maintenance time despite the larger size of individual chambers required for big wafers.
Solution Approach 2:
The chambers are designed with pre-configured separation interfaces and lifting mechanisms that enable quick removal. The support beams and connection structures are arranged to facilitate rapid disassembly and reassembly, allowing maintenance to be performed efficiently without extensive preparation or disassembly time.
3Quantity of substance
If the apparatus size is increased for larger wafers, then the processing capacity is improved, but the complexity of maintenance operations increases
Solution Approach 1:
The processing chamber is segmented into modular upper and lower chambers that can be independently removed and maintained. Each chamber is designed as a self-contained module with standardized connections, simplifying the maintenance procedure despite the overall large size of the apparatus. This modular approach reduces maintenance complexity by breaking down a complex large-scale system into manageable independent units.
4Productivity
If reaction products accumulate on chamber surfaces, then processing continues uninterrupted, but foreign substance contamination occurs
Solution Approach 1:
The upper and lower chambers are designed to be dynamically separable through a lifting mechanism. When contamination is detected or maintenance is required, the upper chamber can be lifted and removed to access and clean reaction product deposits on both upper and lower chamber surfaces. This dynamic design enables rapid maintenance intervention to prevent foreign substance contamination while maintaining processing continuity.
Solution Approach 2:
By segmenting the chamber into independently removable units, maintenance personnel can quickly remove and clean contaminated surfaces without shutting down the entire system for extended periods. The segmented design allows for targeted maintenance of only the contaminated chambers, minimizing production interruption while effectively removing foreign substance sources.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables excellent uniform processing and efficient regular and occasional maintenance, even with larger wafers, by maintaining a coaxial symmetry for gas flow and allowing easy replacement and cleaning of parts, thus reducing contamination and operational downtime.
Implementation Method 1
a workpiece such as a semiconductor wafer is processed, which is held on a sample stage including an electrostatic chuck
Implementation Method 2
plasma is generated from the introduced process gas by a chemical reaction with a radical or by sputtering electrons
Data Source
AI summary
A vacuum processing apparatus that can excellently perform uniform processing and can efficiently perform regular maintenance and occasional maintenance even in the case where the diameter of a workpiece is increased. A vacuum processing apparatus having a vacuum transport chamber includes: a lower container in a cylindrical shape; a sample stage unit including a sample stage and a ring-shaped sample stage base having a support beam disposed in axial symmetry with respect to the center axis of the sample stage; an upper container in a cylindrical shape; and a moving unit that is fixed to the sample stage base and moves the sample stage unit in the vertical direction and in the horizontal direction.