Fixing apparatus
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Solution Overview
Problem
Existing solder ball attaching processes face contamination and positioning failures due to board warpage when no dummy chip is provided, leading to potential defects.
Innovation Solution
A solder ball attaching apparatus with a working die maintained in a vacuum state and movable lifting members, featuring insertion and locking grooves, and elastic components to stabilize chip and board positioning without a dummy chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If no dummy chip is provided during solder ball attaching process, then productivity is improved by reducing unnecessary components, but board warpage occurs causing contamination and positioning failures
Solution Approach 1:
The lifting member acts as an intermediary component between the working die and the board. It provides mechanical support to counteract board warpage in regions where dummy chips are not installed, while enabling precise positioning of the solder ball attaching head through its movable structure with insertion and locking grooves.
Solution Approach 2:
The lifting member is designed to be movable rather than fixed, allowing it to adapt to board warpage dynamically. The elastic restoring force enables the lifting member to adjust its position automatically, maintaining contact with the board surface and preventing positioning failures during the solder ball attaching process.
2Reliability
If dummy chip is installed to prevent board warpage, then positioning accuracy is maintained, but device complexity increases and contamination risk rises
Solution Approach 1:
The invention extracts and eliminates the dummy chip from the system by replacing it with a lifting member integrated into the working die. This simplifies the overall device structure by removing unnecessary components while maintaining the essential function of preventing board warpage and ensuring accurate positioning.
Solution Approach 2:
The lifting member serves multiple functions: it prevents board warpage, provides mechanical support, enables positioning accuracy, and reduces contamination risk. This multi-functional design replaces the single-function dummy chip, reducing device complexity while improving reliability.
3Stability of the object's composition
If dummy chip is used to support board, then board stability is improved, but contamination of working tool occurs
Solution Approach 1:
The lifting member serves as an intermediary that provides board support without introducing contamination risks. By eliminating the dummy chip and using an integrated lifting mechanism, the working tool remains clean while board stability is maintained through the lifting member's support function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents contamination and positioning failures by maintaining vacuum adsorption and stable support, ensuring defect-free solder ball attachment without a dummy chip.
Implementation Method 1
a working die having an internal space maintained in a vacuum state
Implementation Method 2
provide adsorption force through connection to the internal space of the working die maintained in the vacuum state
Implementation Method 3
The lifting member may be lowered by a chip when the chip is seated on the lifting member and may be raised by elastic restoring force when the chip is removed
Data Source
AI summary
A solder ball attaching apparatus includes a working die, having an internal space maintained in a vacuum state, and a plurality of lifting members installed on the working die to be movable upwardly and downwardly. The working die may be provided with an upper plate on which the lifting members are installed. The upper plate may be provided with an insertion groove, into which an upper end portion of the lifting member is inserted when the lifting member is lowered, and a locking groove into which a lower end portion of the lifting member is inserted when the lifting member is raised. The lifting member may be lowered by a chip when the chip is seated on the lifting member and may be raised by elastic restoring force when the chip is removed.