Vacuum Suction Holding Pad Structure for Wafer Detachability
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Solution Overview
Problem
Conventional substrate transfer devices face challenges in detaching wafers from vacuum suction pads due to adhesiveness, leading to potential wafer loss during transfer.
Innovation Solution
The transfer arm incorporates holding pads with an annular part and a projecting portion that intersects the annular direction, allowing for improved detachability by concentrating stress at a specific point during detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum suction is applied to hold the substrate, then the substrate can be securely held during transfer, but the substrate becomes difficult to detach due to adhesiveness
Solution Approach 1:
The holding pad is divided into a base part and an annular part that can relatively move against each other. The annular part can be separated from the base part to create a detachment point, allowing the substrate to be released from vacuum suction by breaking the continuous contact surface into segmented, movable sections.
Solution Approach 2:
The holding pad transitions from a static structure to a dynamic one where the annular part can move relative to the base part. This dynamic capability allows the system to switch between holding state (annular part pressed against substrate) and release state (annular part separated from substrate), resolving the contradiction between secure holding and easy detachment.
2Device complexity
If a simple pad structure is used, then the device complexity is reduced, but the detachability of the substrate is insufficient
Solution Approach 1:
The holding pad is segmented into a base part and an annular part that can relatively move. This segmentation adds minimal structural complexity while enabling the annular part to be separated to create a detachment point, improving substrate release capability without requiring a completely complex mechanism.
Solution Approach 2:
Only the annular part of the holding pad is designed with movement capability relative to the base part, rather than making the entire structure complex. This localized quality change provides the necessary detachability function while keeping the overall device complexity low.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the detachability of wafers from the transfer arm, preventing wafer loss and ensuring smooth transfer operations.
Implementation Method 1
a base part disposed on a surface of the pick and having a through-hole for vacuum suction
Data Source
AI summary
This conveyance arm conveys a substrate by means of vacuum suction under atmospheric pressure, and includes a pick that holds the substrate, and a plurality of holding pads provided on the surface of the pick, wherein the holding pads each have a base part provided on the front surface of the pick and having a vacuum-suctioning through-hole formed therein, and an annular part provided annularly on the surface of the base part and contacting the rear surface of the substrate, and a protrusion is formed on a portion of the annular part in a direction intersecting an annular direction of the annular part. A substrate conveyance device for conveying a substrate under atmospheric pressure includes said conveyance arm.