Vacuum Pickup Recess Layout to Protect Conductive Studs
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Solution Overview
Problem
The edges of vacuum nozzles in pick-and-place machines can damage conductive studs on semiconductor dice, causing tilting or shifting, and generate debris that affects the yield of subsequent processes during the recombination process for manufacturing electronic packages.
Innovation Solution
A suction device with strategically designed recesses that avoid overlapping with conductive studs, allowing for precise pickup without damaging them, thereby preventing debris generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the suction device uses a standard vacuum nozzle design, then it can effectively pick up semiconductor dice, but the edges of the vacuum nozzle contact and collide with conductive studs, causing damage
Solution Approach 1:
The suction device is divided into multiple independent recesses, each capable of picking up semiconductor dice individually. This segmentation allows the suction device to maintain effective pickup capability while avoiding contact with conductive studs through strategic positioning of each recess
Solution Approach 2:
The edges of the recesses are strategically positioned to have different spatial relationships with conductive studs versus the pickup function. The recess edges are designed to avoid overlapping with conductive studs from a top view, creating a local quality that prevents damage while maintaining suction effectiveness
2Force
If the suction device edges contact conductive studs during pickup, then it can secure the semiconductor die, but this causes the conductive studs to tilt or shift
Solution Approach 1:
The harmful contact function is extracted from the suction device design. By designing recesses that do not contact conductive studs, the patent removes the source of tilting and shifting forces while maintaining the essential suction function through vacuum pressure applied to the semiconductor die surface
3Ease of operation
If the vacuum nozzle edges collide with conductive studs, then it can grip the semiconductor die, but this generates exfoliated debris that affects subsequent process yield
Solution Approach 1:
The patent applies preliminary anti-action by designing the recess geometry and positioning to prevent the collision that would generate debris in the first place. The recess edges are strategically positioned to avoid overlapping with conductive studs, proactively preventing the harmful collision before it can occur during the pickup operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage to conductive studs and reduces debris, enhancing the yield of subsequent processes by maintaining the integrity of semiconductor dice during handling.
Implementation Method 1
a suction device having at least one recess... moving the electronic component with the suction device
Data Source
AI summary
A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.