Vacuum Robot Arm With Electrostatic Gripper for Faster Wafer Handling
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Solution Overview
Problem
Material-handling robots in vacuum environments face limitations due to passive payload holding, which restricts acceleration and increases operation duration, and active gripping is challenging due to vacuum compatibility issues and contamination risks.
Innovation Solution
A vacuum-compatible robot with integrated electrically-operated payload grippers using dielectric substrates and electrodes to generate attractive forces, allowing for high holding forces and reduced contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive friction-based payload holding is used, then the system maintains vacuum compatibility and avoids contamination, but the acceleration is limited and operation duration increases
Solution Approach 1:
The patent replaces the passive mechanical friction-based holding system with an active electrostatic gripping system. Electrodes generate electrostatic attractive forces to hold the payload, enabling higher acceleration without slippage while maintaining vacuum compatibility through contactless operation.
Solution Approach 2:
The patent changes the fundamental parameter of payload holding from passive friction (dependent on normal force and coefficient of friction) to active electrostatic attraction (dependent on voltage and electrode geometry). This parameter change enables higher holding forces and faster acceleration while maintaining vacuum environment compatibility.
2Productivity
If active mechanical gripping components are introduced, then higher holding forces and acceleration are achieved, but contamination risk increases due to particulate matter from moving components
Solution Approach 1:
The patent eliminates moving mechanical gripping components by using electrostatic fields for payload retention. This substitution removes the source of particulate contamination from mechanical wear and contact while maintaining high holding forces, thus improving both acceleration capability and cleanliness.
Solution Approach 2:
The patent introduces an electrostatic field as an intermediary between the gripper and payload. This field-based interaction replaces direct mechanical contact, allowing high-force holding without physical contact that would generate contaminants, thus resolving the contradiction between acceleration and contamination risk.
3Productivity
If electrostatic gripping is implemented, then higher acceleration and reduced operation time are achieved, but system complexity increases due to power delivery and control requirements
Solution Approach 1:
The patent extracts the power delivery and control requirements from the vacuum environment to the external environment. Power is delivered through the robot arm structure, and control signals are transmitted through existing communication infrastructure, minimizing the complexity within the vacuum chamber while enabling high-speed operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables higher acceleration and reduced operation time, enhancing productivity in semiconductor wafer processing systems without increasing contamination risks.
Implementation Method 1
at least one electrode disposed on the dielectric substrate, the at least one electrode being configured to produce an attractive force on a surface of the electrode to attract the payload
Data Source
AI summary
An apparatus includes a drive; a movable arm connected to the drive and having a first link rotatable about the drive at a first rotary joint, a first actuator configured to cause a rotation of the first link about the first rotary joint, at least one second link connected to the first link at a second rotary joint, at least one second actuator configured to cause a rotation of the second link about the second rotary joint, and at least one gripper on the second link, the gripper being configured to carry a payload. The gripper includes a dielectric substrate, at least one electrode disposed on the dielectric substrate, the electrode being configured to produce an attractive force on a surface of the electrode to attract the payload, and a main electronic module configured to apply a voltage to the electrode from a source of current.