Vacuum Screen Assembly for Semiconductor Particle Reduction
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Solution Overview
Problem
Semiconductor processing chambers face defects due to particles generated by mechanical movement outside the processing area, which are not effectively removed by plasma cleaning, necessitating a solution to reduce particles in these areas.
Innovation Solution
The implementation of a vacuum screen assembly with reduced line of sight between the vacuum pump and the processing chamber, and a perforated chamber liner with non-uniformly distributed through holes, along with a gas distributing chamber liner for cleaning gas distribution, to prevent particle entry and improve fluid flow uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma cleaning is used to remove particles in the substrate processing region, then particles in the processing area are removed, but particles generated outside the processing area (by mechanical movement of throttle valve, slit valve door, lift pins) cannot be effectively removed
Solution Approach 1:
A screen is introduced as an intermediary component between the vacuum pump and the processing chamber. This screen physically blocks particles generated by mechanical movement outside the processing area (throttle valve, slit valve door, lift pins) from entering the processing region, while still allowing gas flow to maintain vacuum conditions.
Solution Approach 2:
The chamber is segmented into distinct regions: a processing area and a pump area separated by a screen. This segmentation allows different cleaning strategies to be applied to different regions, and prevents cross-contamination between areas with different particle generation characteristics.
2Object-affected harmful factors
If a screen is placed between the vacuum pump and processing chamber to block particles, then particle entry is prevented, but gas flow may be restricted
Solution Approach 1:
The screen is designed with a porous structure containing multiple openings. These openings are sufficient to maintain gas flow for vacuum operation while being configured to block particles from passing through. The porous design allows the screen to simultaneously achieve particle filtration and gas permeability.
3Quantity of substance
If through holes are formed in the chamber liner to improve gas flow, then fluid flow uniformity is enhanced, but particle paths may be created
Solution Approach 1:
The chamber liner is designed with non-uniform through hole distribution, where different regions have different densities of openings. This local quality variation optimizes gas flow uniformity in specific areas while the overall configuration maintains particle blocking capability, particularly in regions where particle generation is highest.
Data Source
AI summary
Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.