Dual-Sided Vacuum Substrate Hand for Low-Dust Positioning

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Solution Overview

Problem

Existing substrate transportation systems generate dust due to mechanical contact, which can lead to production defects and damage in imprinting apparatuses, especially in microfabrication processes for semiconductor devices and MEMS, where stringent control of dust and chemical contamination is required.

Innovation Solution

A substrate transportation hand with independent vacuum suction mechanisms on the upper and lower surfaces, allowing for balanced and dust-free handling of substrates, using either vacuum or electrostatic adsorption to prevent mechanical contact and minimize particle generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a mechanical holding mechanism is used to lock the substrate position, then the substrate can be securely held and positioned, but dust is generated due to contact and sliding

Engineering Contradiction:
Improvesubstrate holding stabilityVSAvoiddust generation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the mechanical holding mechanism with a vacuum suction system. Instead of using mechanical claws or locks that contact and slide on the substrate surface, the invention uses vacuum pressure to hold the substrate through suction holes. This substitution eliminates mechanical contact and sliding, thereby preventing dust generation while maintaining reliable substrate positioning.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs vacuum suction (a pneumatic principle) to hold and transport the substrate. By creating negative pressure through suction holes in the transportation hand, the substrate is securely held without mechanical contact. This pneumatic approach resolves the contradiction by providing reliable holding stability without the dust-generating mechanical interactions.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Object-generated harmful factors

If vacuum suction is applied to hold the substrate, then dust generation is reduced, but the substrate may not be securely positioned without mechanical contact

Engineering Contradiction:
Improvedust generationVSAvoidsubstrate positioning accuracy
Core Design Contradiction:
Object-generated harmful factorsVSReliability

Solution Approach 1:

The patent replaces mechanical positioning mechanisms with vacuum suction-based positioning. The suction holes are strategically positioned to not only hold the substrate but also to position it accurately through the distribution of vacuum force. This substitution maintains positioning accuracy without requiring mechanical contact that would generate dust.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If mechanical holding is used on the upper surface, then substrate position is determined, but particles are likely to be generated due to contact and sliding

Engineering Contradiction:
Improvesubstrate position determinationVSAvoidparticle generation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent replaces mechanical holding structures with vacuum suction holes on the upper surface. The suction holes determine substrate position through the pattern and location of vacuum application, eliminating the need for mechanical contact. This resolves the contradiction by achieving manufacturing precision through pneumatic positioning rather than mechanical means, thereby preventing particle generation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and precise substrate transportation with reduced dust adhesion, enhancing productivity and quality in micro-device production by minimizing defects and maintaining high accuracy.

Implementation Method 1

When the groove portion is connected to a vacuum suction mechanism such as a vacuum pump and the vacuum suction mechanism is operated, a negative pressure is applied to the groove portion so that the substrate can be sucked and held on the lower surface side of the transportation hand.

Methodology Applied
Scientific EffectVacuum suction: Vacuum

Data Source

PatentUS12489012B2Substrate transportation hand, substrate transportation system, storage medium, and method for producing article
Publication Date: 2025.12.02 CANON KK
  • US12489012B2 patent drawing
  • US12489012B2 patent drawing
  • US12489012B2 patent drawing

AI summary

A substrate transportation hand for transporting a substrate includes: at least one first holding part provided on an upper surface side of the substrate transportation hand and capable of sucking and holding the substrate; at least one second holding part provided on a lower surface side of the substrate transportation hand and capable of sucking and holding the substrate; and a drive unit for independently turning on/off sucking using the first holding part and the second holding part, in order to provide a substrate transportation hand which can efficiently transport while preventing dust in accordance with a form of a substrate.