Vacuum Substrate Support for Simultaneous Polishing and Cleaning
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Solution Overview
Problem
In semiconductor manufacturing, the non-planarization of wafer surfaces due to high integration and multilayered structures leads to defocus issues in photolithography processes, necessitating effective surface polishing techniques to achieve planarization.
Innovation Solution
A substrate supporting unit and apparatus that sequentially perform polishing and cleaning processes using a vacuum plate with magnetically driven chuck members and a cleaning unit, allowing for precise support and simultaneous polishing and cleaning of both top and bottom surfaces of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional multi-step process is used for polishing and cleaning substrates, then the substrate can be processed, but the processing time increases and productivity decreases
Solution Approach 1:
The patent combines the polishing process and cleaning process into a single integrated apparatus and method. The substrate is polished on one surface while simultaneously cleaned on the opposite surface, merging two separate sequential operations into one concurrent operation, thereby reducing total processing time and improving productivity
Solution Approach 2:
The polishing and cleaning operations are performed continuously and simultaneously on opposite surfaces of the substrate without interruption. The substrate remains in the apparatus throughout both processes, eliminating transfer time and maintaining continuous useful action throughout the processing cycle
2Manufacturing precision
If the substrate is held firmly against the vacuum plate during polishing, then polishing precision is maintained, but cleaning effectiveness is reduced
Solution Approach 1:
The vacuum plate dynamically changes its state during the process: initially applying vacuum to hold the substrate firmly for precise polishing, then releasing the vacuum to allow the substrate to be lifted for effective cleaning. This dynamic adjustment of the vacuum state enables the system to optimize for different operational requirements at different stages
3Manufacturing precision
If multiple separate apparatuses are used for polishing and cleaning, then each process can be optimized independently, but device complexity and space requirements increase
Solution Approach 1:
The vacuum plate serves multiple functions: it acts as a support surface during polishing, a release mechanism for substrate removal, and a positioning element for cleaning operations. The single apparatus integrates both polishing and cleaning capabilities, reducing overall system complexity while maintaining process effectiveness through multi-functional design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient planarization of wafer surfaces by mechanically and chemically polishing the substrate, followed by effective cleaning, thereby reducing defocus issues and improving the quality of semiconductor devices.
Implementation Method 1
a vacuum plate vacuum-absorbing a substrate
Implementation Method 2
a lower magnet member in which a magnetic pole thereof is oriented such that a magnetic repulsive force acts between the upper and lower magnet members
Data Source
AI summary
Provided are a substrate supporting unit and an apparatus and method for polishing a substrate using the same. The substrate supporting unit vacuum-absorbs a bottom surface of the substrate during a polishing process, and supports the substrate in a state where the substrate is upwardly spaced from the substrate supporting unit to clean the substrate during a post-cleaning process. Therefore, in the substrate supporting unit and the apparatus and method for polishing the substrate using the same, a polishing process on a top surface of the substrate and a post-cleaning process on the top and bottom surfaces of the substrate may be sequentially performed in a state where the substrate is supported by a single wafer type substrate supporting unit.