Vacuum Transfer Device Nozzle Fabrication for MicroLED Panels
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Solution Overview
Problem
Conventional vacuum transfer devices for microLEDs are costly and time-consuming, making them unsuitable for large-size or high-resolution display panels.
Innovation Solution
A method of forming a vacuum transfer device using semiconductor device fabrication techniques, involving multiple mask layers and etching processes to create a pattern of holes and nozzles in a semiconductor substrate, enabling efficient transfer of microLEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional laser or electromagnetic techniques are used to manufacture vacuum transfer devices, then the transfer precision and reliability are improved, but the manufacturing cost and time increase substantially
Solution Approach 1:
The patent replaces conventional laser or electromagnetic manufacturing techniques with semiconductor device fabrication techniques, specifically using photolithography and etching processes. This substitution enables the formation of vacuum transfer devices through standard semiconductor manufacturing workflows, dramatically reducing manufacturing time while maintaining precision through controlled etching processes that create accurate nozzle geometries and vacuum chamber structures.
Solution Approach 2:
The patent changes the manufacturing parameters from high-energy laser/electromagnetic processes to lower-energy photolithographic patterning and chemical etching. By controlling etch depth, etch rate, and mask patterns, the device geometry is precisely defined without the substantial time and cost overhead of conventional methods, enabling scalable production.
2Reliability
If conventional laser or electromagnetic techniques are used to manufacture vacuum transfer devices, then the transfer precision and reliability are improved, but the manufacturing cost increases substantially
Solution Approach 1:
The patent replaces expensive laser or electromagnetic manufacturing equipment and processes with standard semiconductor fabrication equipment and chemical etching processes. This substitution leverages existing semiconductor manufacturing infrastructure, reducing capital equipment costs and operational expenses while maintaining device performance through precisely controlled etching parameters and mask-based patterning.
Solution Approach 2:
The patent employs disposable photoresist masks and sacrificial layers that are consumed during the fabrication process. These low-cost consumable materials enable precise pattern transfer through etching without requiring expensive reusable tooling or fixtures, significantly reducing per-unit manufacturing cost while maintaining high precision through mask-defined geometries.
3Adaptability or versatility
If conventional vacuum transfer devices are used, then the transfer capability is adequate, but they cannot be adapted to large-size or high-resolution display panels
Solution Approach 1:
The patent segments the vacuum transfer device into modular components including an array of independently addressable nozzles, separable mask layers, and divided vacuum chambers. This segmentation enables the device to be configured for different display panel sizes and resolutions by activating only the required nozzle subsets, while the modular structure simplifies manufacturing through standardized repeating units that can be tiled across large substrates.
Solution Approach 2:
The patent designs a universal vacuum transfer device platform that can handle multiple display panel configurations through programmable nozzle activation and adjustable vacuum parameters. The same fabricated device structure serves multiple functions by selectively engaging different nozzle arrays and adjusting etch depth patterns, eliminating the need for custom-manufactured devices for each display size or resolution requirement.
Data Source
AI summary
A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.