Vacuum Transfer Module Layout for Substrate and Ring Handling
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in attaching various modules with different internal dimensions and transfer distances without altering the design of the vacuum transfer module, requiring accurate transfer of substrates and annular members between modules with distinct specifications.
Innovation Solution
A substrate processing apparatus is designed with a vacuum transfer module, wall unit featuring first and second gate valves of different widths, a substrate processing module, and a ring stocker, along with a transfer mechanism that enables the transfer of substrates and annular members between the vacuum transfer space and processing spaces through these valves, allowing for the attachment of multiple module types without changing the vacuum transfer module's design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single vacuum transfer module design is used, then device complexity is reduced, but adaptability to different modules with varying dimensions and transfer distances deteriorates
Solution Approach 1:
The vacuum transfer module is divided into multiple independent transfer spaces (first vacuum transfer space, second vacuum transfer space, third vacuum transfer space) that can operate independently. Each transfer space can be configured with different gate valve arrangements and transfer mechanisms, allowing the system to adapt to different module types (substrate processing modules, ring stockers, etc.) without redesigning the entire vacuum transfer module.
2Adaptability or versatility
If gate valves of different widths are used for different modules, then adaptability to various module dimensions is improved, but device complexity increases
Solution Approach 1:
Different regions of the vacuum transfer module are equipped with different gate valve configurations tailored to their specific needs. The first gate valve (narrower) is used for substrate transfer where precision is critical, while the second gate valve (wider) is used for ring stocker access where larger component passage is needed. This localized optimization allows the system to handle diverse module types without requiring a completely different transfer module design.
3Adaptability or versatility
If transfer distance is increased to accommodate larger modules, then adaptability is improved, but manufacturing precision of transfer positioning deteriorates
Solution Approach 1:
Instead of increasing transfer distance in a single dimension, the patent introduces multiple transfer spaces arranged in different spatial configurations. The first transfer space handles substrate transfers with shorter distances, while the second and third transfer spaces handle ring stocker operations. By distributing transfer operations across multiple dimensions and spaces, the system accommodates larger module configurations without compromising the positioning precision of individual transfer operations.
Data Source
AI summary
Embodiments of this application discloses a substrate processing apparatus comprising: a vacuum transfer module having a vacuum transfer space and an opening; a wall unit attached to the opening and including a first gate valve and a second gate valve; a substrate processing module attached to the wall unit and having a substrate processing space communicating with the vacuum transfer space via the first gate valve; and a ring stocker attached to the wall unit and having a storage space for storing at least one annular member used in a plasma processing module. Moreover, the apparatus further includes a transfer mechanism disposed in the vacuum transfer space and transfers a substrate between the vacuum transfer space and the substrate processing space through the first gate valve and also transfers at least one annular member between the vacuum transfer space and the storage space via the second gate valve.