Vacuum Valve Ceramic Heat Dissipation Structure for Compact Cooling

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Solution Overview

Problem

Conventional heat dissipation structures for vacuum valves and LED headlights face challenges in efficiently dissipating heat while maintaining device size and performance, especially under high voltage and large current conditions, with insulation gaps reducing heat conductivity and increasing device size.

Innovation Solution

A heat dissipation structure integrating a ceramic or resin heat dissipation layer with a radiation heat absorption layer, opposed to each other, is used within the device, allowing efficient heat radiation and absorption, reducing the need for large cooling fins and maintaining high performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a cooling fin made of metal is used to dissipate heat from a vacuum valve, then heat dissipation capability is improved, but device size increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent replaces the conventional metal cooling fin structure with a ceramic heat dissipation layer that utilizes thermal radiation instead of relying solely on thermal conduction through metal fins. This substitution of the heat dissipation mechanism allows for more efficient heat removal without requiring large external fin structures, thereby reducing device size while maintaining or improving heat dissipation capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the material parameter from metal to ceramic for the heat dissipation layer, and optimizes the thickness parameter of the ceramic layer to achieve optimal heat dissipation performance. By adjusting these parameters, the system achieves efficient heat dissipation with a compact structure, resolving the contradiction between heat dissipation capability and device size.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a gap is provided between electrode and electrode cover for insulation, then insulation performance is improved, but heat conduction capability deteriorates

Engineering Contradiction:

Improveinsulation performanceVSAvoidheat conduction capability

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent introduces a ceramic heat dissipation layer as an intermediary substance between the electrode and the external environment. This ceramic layer serves dual functions: it provides electrical insulation similar to the gap, but simultaneously acts as a thermal conductor to efficiently transfer heat away from the electrode, thereby resolving the contradiction between insulation performance and heat conduction capability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite material structure where ceramic material is used to create a heat dissipation layer that combines insulating and heat-conducting properties. The ceramic material's unique properties allow it to maintain electrical insulation while providing superior thermal conduction compared to the gap structure, thus resolving the contradiction between these two requirements.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient heat dissipation, reducing device size while supporting high voltage and large current capabilities, and preventing thermal shock and arc generation, thus enhancing overall performance.

Implementation Method 1

heat generated in the heat generation part is radiated by the heat dissipation layer

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

is absorbed by the radiation heat absorption layer provided so as to be opposed to the heat dissipation layer

Methodology Applied

Scientific EffectRadiation heat absorption: Absorption (EM radiation)

Data Source

PatentUS12196389B2Heat dissipation structure, manufacturing method therefor, and vacuum valve

Publication Date: 2025.01.14 MITSUBISHI ELECTRIC CORP

AI summary

In a vacuum valve, as a heat dissipation structure thereof, a heat dissipation layer is provided to a part of the surface of each of a fixed conductor and a movable conductor which are a heat generation part, and a radiation heat absorption layer is provided to an insulation cylinder so as to be opposed to the heat dissipation layer. The heat dissipation layer and the radiation heat absorption layer are each formed from a ceramic having a high emissivity. Heat generated at the fixed conductor and the movable conductor is radiated by the heat dissipation layer, to be absorbed by the radiation heat absorption layer, and then radiated to the outside of the vacuum valve from the radiation heat absorption layer and a ceramic layer.