Vapor Chamber Support Column Layout for Faster Cooling Assembly
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Solution Overview
Problem
Current vapor chambers face manufacturing difficulties due to the use of multiple molds and are not universally applicable to different electronic heat generating sources, limiting their effectiveness in cooling diverse components.
Innovation Solution
A vapor chamber design featuring a first housing, supporting columns, a capillary structure, a second housing, and a working fluid, with a bonding layer between the housings, allowing for flexible positioning of supporting columns to adapt to specific cooling needs, and a manufacturing method involving bonding paste application, capillary structure attachment, and degassing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional vapor chamber manufacturing processes are used with multiple molds for injection, feeding and edge folding, then the cooling performance can be achieved, but the manufacturing time and complexity increase significantly
Solution Approach 1:
The patent merges multiple manufacturing steps (injection, feeding, edge folding) into a single integrated molding process. The support columns are directly formed within the vapor chamber housing during one injection molding operation, eliminating the need for separate molding steps and reducing manufacturing time while maintaining cooling performance.
Solution Approach 2:
The patent segments the vapor chamber into a housing and integrated support columns that are formed as separate functional elements within a single molding process. This allows the support columns to be positioned flexibly within the housing while being manufactured efficiently in one step.
2Reliability
If vapor chambers are designed with fixed supporting columns for specific cooling needs, then cooling effectiveness is improved, but adaptability to different electronic heat generating sources is reduced
Solution Approach 1:
The patent makes the support column configuration dynamic and adjustable rather than fixed. Multiple support columns are provided that can be selectively positioned or configured based on the specific cooling requirements of different electronic heat generating sources, allowing the same vapor chamber design to adapt to various applications.
Solution Approach 2:
The patent designs the vapor chamber with a universal housing structure that can accommodate different configurations of support columns. This universal design allows the same basic vapor chamber to serve multiple cooling applications by adjusting the position and arrangement of the support columns to match different heat generating sources.
3Manufacturing precision
If complex molding processes are used to create precise vapor chamber structures, then manufacturing precision is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple complex molding operations into a single injection molding step. The support columns and housing are formed together in one process, achieving precise structural dimensions without requiring multiple sequential molding operations, thereby reducing manufacturing complexity while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing time and enhances adaptability to various electronic heat sources, providing efficient cooling performance across different components.
Implementation Method 1
a capillary structure (30) disposed on the inner surface (11) of the first housing (10)
Implementation Method 2
a bonding layer (50) formed between the inner surface (11) of the first housing (10) and the end surface (21) of each one of the supporting columns (20)
Implementation Method 3
The scope covered by vapor chambers is broad, and vapor chambers are known to have short heat conduction path and have cooling performance superior to heat pipes
Data Source
AI summary
A vapor chamber and a manufacturing method thereof are disclosed. The vapor chamber includes a first housing, multiple supporting columns, a capillary structure, a second housing, a bonding layer, and a working fluid. The first housing includes an inner surface. Each supporting column is disposed on the inner surface of the first housing and includes an end surface. The capillary structure is disposed on the inner surface of the first housing. The second housing is sealed with the first housing correspondingly to jointly define a chamber. The bonding layer is formed between the inner surface of the first housing and the end surfaces of the supporting columns. The working fluid is arranged inside the chamber. Accordingly, it is able to swiftly changing the positions of the supporting columns according to the actual cooling needs, thereby significantly reducing the manufacturing time required.