Vapor Chamber Cooling Device for Electronic Elements
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Solution Overview
Problem
Current cooling devices for electronic elements, including those using aluminum and copper blocks or heat pipes, fail to adequately manage the increased heat generated by high operational and computational speeds, leading to limited cooling performance and high manufacturing costs.
Innovation Solution
A cooling device featuring a vapor chamber with surface contact to the electronic element, combined with a cooling body and fixing seat, utilizing a heat-conducting media to enhance heat transfer and prevent heat accumulation, achieving two-dimensional heat transfer and improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heat pipes are used to improve cooling performance, then cooling efficiency is enhanced, but manufacturing cost increases notably
Solution Approach 1:
The patent merges multiple heat pipes into a single integrated vapor chamber structure. Instead of using separate heat pipes that require precise positioning and multiple contact points, the invention consolidates them into one vapor chamber that provides surface contact with the electronic element, achieving comparable or superior cooling performance while reducing manufacturing complexity and cost.
Solution Approach 2:
The invention transitions from line contact (multiple discrete heat pipes) to surface contact (vapor chamber). This dimensional change from one-dimensional line contact to two-dimensional surface contact improves heat transfer efficiency while simplifying the overall structure, thereby enhancing cooling performance without proportionally increasing manufacturing cost.
2Temperature
If heat pipes are spaced apart to achieve surface contact, then cooling performance improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple discrete heat pipe components into a single integrated vapor chamber. This merging eliminates the need for precise spacing and positioning of multiple heat pipes, reducing manufacturing complexity while maintaining surface contact with the electronic element for improved cooling performance.
3Ease of manufacture
If traditional heat conduction through metallic blocks is used, then manufacturing is simple, but cooling performance is insufficient for high-speed electronic elements
Solution Approach 1:
The invention utilizes phase transition of the working fluid within the vapor chamber to enhance heat transfer. The working fluid evaporates at the heat input surface (contacting the electronic element) and condenses at the heat dissipation surface, providing highly efficient heat transfer that surpasses traditional metallic block conduction while maintaining manufacturing simplicity.
Solution Approach 2:
The vapor chamber structure combines a sealed enclosure with a working fluid, creating a composite heat transfer system. This composite approach integrates the advantages of phase change heat transfer with a simple structural form, achieving high cooling performance without complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber design significantly enhances cooling performance by rapid heat transfer and reduces manufacturing costs through surface contact and efficient heat management, ensuring optimal cooling of electronic elements.
Implementation Method 1
the waste heat generated from the electronic element transferred to the cooling body by means of a phase change of a working fluid stored in the heat pipe
Implementation Method 2
a cooling body made of aluminum directly contacts the surface of the electronic element, making the heat generated from the electronic element conducted to the surface of the cooling body
Implementation Method 3
the heat is carried away by an air flow
Data Source
AI summary
A cooling device for dissipating heat generated by an electronic element includes a fixing seat, a cooling body, and a vapor chamber. The fixing seat is arranged an opening. The cooling body includes a bottom plate attached onto the fixing seat and a plurality of cooling fins that are interspaced to each other and are attached to the bottom plate, in which a fixing hole is arranged at one side of the bottom plate, and an accommodating space is configured at the cooling fins in corresponding to the fixing hole. The vapor chamber is accommodated in the opening of the fixing seat, and one side of the vapor chamber contacts a bottom part of the cooling body, while another side contacts the electronic element.