Direct-Cooling Vapor Chamber for Power Module Thermal Management

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Solution Overview

Problem

High-voltage electrical power systems in electrified vehicle powertrains face challenges in thermal management, particularly in efficiently cooling power electronic modules, which can lead to reduced power density, operational life, and increased complexity and weight.

Innovation Solution

The implementation of direct-cooling vapor chamber systems within power module assemblies, where two-phase heat-spreading vapor chambers are used to transfer device-generated heat to a coolant chamber for efficient thermal management, allowing for the use of high-voltage IGBT and WBG devices, thereby improving powertrain performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling systems are used for power electronic modules, then thermal management is provided, but system complexity and weight increase

Engineering Contradiction:

Improvethermal management efficiencyVSAvoidsystem complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the cooling function directly into the power module housing by integrating a coolant chamber and vapor chamber cooling system within the same structural envelope. This consolidation eliminates the need for separate external cooling systems, thereby reducing overall system complexity while maintaining effective thermal management.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a nested cooling architecture where vapor chambers are positioned within the power module housing, and coolant chambers are nested within the vapor chamber structures. This multi-level nesting approach allows compact thermal management integration without increasing external dimensions or system complexity.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Temperature

If conventional cooling systems are used for power electronic modules, then thermal management is provided, but weight increases

Engineering Contradiction:

Improvethermal management efficiencyVSAvoidsystem weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

By combining the cooling system with the power module housing structure, the patent eliminates redundant structural components that would otherwise be required for separate cooling systems. This integration significantly reduces the overall weight while maintaining effective heat dissipation capabilities.

Inventive Principle:

Principle #5Merging (Combining)

3Power

If power density is increased in power electronic modules, then performance improves, but thermal management difficulty increases

Engineering Contradiction:

Improvepower densityVSAvoidthermal management difficulty

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent implements localized cooling zones within the power module, with vapor chambers positioned at specific high-heat-generation areas. This targeted approach to thermal management allows high power density in critical regions while providing proportionate cooling capacity where needed, rather than requiring uniform cooling across the entire module.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances power density, operational life, and reduces system complexity and weight, while improving vehicle range and fuel economy by providing efficient thermal management for power electronic modules.

Implementation Method 1

two-phase heat-spreading vapor chambers are used to transfer device-generated heat to a coolant chamber

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

vapor chambers transfer device-generated heat to the coolant chamber

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11375642B2Electronic power module assemblies and control logic with direct-cooling vapor chamber systems

Publication Date: 2022.06.28 GM GLOBAL TECHNOLOGY OPERATIONS LLC

AI summary

Presented are electronic power module assemblies with direct-cooling vapor chamber systems, methods for making/using such power module assemblies, and vehicles equipped with such power module assemblies. A power module assembly includes an outer housing with an internal coolant chamber that circulates therethrough a coolant fluid. A power semiconductor switching device is mounted to the module's housing, separated from the coolant chamber and isolated from the coolant fluid. The power device selectively modifies electric current transmitted between a power source and an electrical load. A two-phase, heat-spreading vapor chamber device includes an outer casing with a casing segment that is mounted to the module housing, fluidly sealed to the internal coolant chamber and exposed to the coolant fluid. Another casing segment includes an inboard-facing casing surface that is mounted to an outboard-facing surface of the power device, and an outboard-facing casing surface mounted to an inboard-facing surface of the power device.