Variable Height Heat Sink Fin Stages for Data Center Cooling

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Solution Overview

Problem

Data centers face cooling challenges due to the high heat generation and density of computing devices, particularly mining rigs, as traditional heat sinks with small fin spacing suffer from reduced heat transfer efficiency due to rising air temperatures, leading to reliability and longevity issues of components.

Innovation Solution

A heat sink system with fin stages of increasing height and width from intake to exhaust, along with air separators to guide cooler air to downstream stages, enhances heat removal efficiency and compensates for rising air temperatures, improving thermal management in data centers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional heat sinks with small fin spacing are used to accommodate more fins, then the number of fins increases to improve thermal performance, but heat transfer efficiency decreases due to rising air temperature as it passes over each stage

Engineering Contradiction:
Improveheat removal rateVSAvoidheat transfer efficiency
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by varying the fin stage heights according to the local thermal conditions. Downstream fin stages have greater heights to compensate for the reduced heat transfer efficiency caused by warmer air, while upstream stages have smaller heights. This creates a non-uniform heat sink structure where each local region is optimized for its specific operating conditions, resolving the contradiction between maintaining high heat removal rates and preserving heat transfer efficiency throughout the heat sink.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent implements parameter changes by modifying the geometric parameter of fin stage heights along the airflow direction. Instead of using uniform fin heights, the design progressively increases the height of downstream fin stages. This parameter variation compensates for the deteriorating thermal performance caused by rising air temperature, allowing the heat sink to maintain effective heat transfer efficiency across all stages while achieving high overall heat removal rates.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If fin stages are made uniformly tall to maximize heat removal, then heat transfer efficiency improves, but material usage and device complexity increase

Engineering Contradiction:
Improveheat removal efficiencyVSAvoidheat sink structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

Rather than making all fin stages uniformly tall, the patent applies local quality by designing each fin stage with a height appropriate to its specific location in the airflow path. Upstream stages use shorter fins where air is cooler and heat transfer efficiency is naturally higher, while downstream stages use taller fins to compensate for warmer air. This localized optimization achieves high overall heat removal efficiency while avoiding the unnecessary material usage and structural complexity that would result from uniformly tall fins throughout.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively increases heat removal efficiency by maximizing surface area and ensuring ambient air reaches downstream stages, thereby improving the reliability and longevity of computing devices by effectively managing thermal loads.

Implementation Method 1

heat sinks for data miners that vary in height... force air across heat sinks on the computing device in order to extract and exhaust the waste heat

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12041754B1Heat sink that varies in height
Publication Date: 2024.07.16 CORE SCI INC
  • US12041754B1 patent drawing
  • US12041754B1 patent drawing
  • US12041754B1 patent drawing

AI summary

A heat sink for cooling computing devices such as in a data center is disclosed. The heat sink includes a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side. The plurality of fin stages have a height that increases from the intake side to the exhaust side.