Variable Pressure Elastic Membrane Substrate Separation
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Solution Overview
Problem
The existing substrate processing apparatuses face challenges in uniformly separating substrates from elastic membranes due to varying attachment forces, leading to inconsistent substrate release times and potential physical stress, which can result in substrate breakage.
Innovation Solution
A substrate processing apparatus with a pressure regulator and controller that adjusts the gas pressure inside the elastic membrane to match the attachment force of the substrate, allowing for variable pressure control to optimize substrate release, including setting specific pressures for different substrate types and stages of release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a fixed pressure is supplied into the elastic membrane to separate the substrate, then the separation process is simple, but the substrate release time varies and physical stress occurs due to different attachment forces
Solution Approach 1:
The patent applies dynamics by making the gas pressure variable rather than fixed. The controller dynamically adjusts the pressure based on the attachment force characteristics of different substrates, enabling consistent separation timing across various substrate types while maintaining operational simplicity through automated pressure modulation
Solution Approach 2:
The patent changes the pressure parameter from a static value to a variable parameter that adapts to different substrate attachment forces. By modifying the pressure magnitude and timing based on substrate type, the system achieves uniform separation performance without complicating the overall operation process
2Reliability
If high pressure is supplied into the elastic membrane to separate strong attachment substrates, then separation is achieved, but physical stress and substrate breakage occur
Solution Approach 1:
The patent applies parameter changes by tailoring the pressure magnitude to match the attachment force of different substrates. The controller selects appropriate pressure values that are sufficient for separation but not excessive, thereby preventing physical stress and substrate breakage while maintaining reliable separation success
Solution Approach 2:
The patent implements beforehand cushioning by pre-calculating and pre-setting appropriate pressure values based on substrate type before the separation process begins. This preventive approach ensures that sufficient pressure is applied to overcome attachment forces without exceeding the threshold that would cause physical stress or breakage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the variation in substrate release time across different substrates and types, minimizing physical stress and preventing breakage by dynamically adjusting the inflation rate and pressure of the elastic membrane.
Implementation Method 1
a substrate (e.g., a wafer) adsorbed to an elastic membrane (also referred to as a 'membrane') of a substrate holding unit
Implementation Method 2
separated from the elastic membrane by supplying a gas (e.g., nitrogen) having a predetermined pressure into the elastic membrane
Implementation Method 3
an elastic membrane (also referred to as a 'membrane') of a substrate holding unit
Data Source
AI summary
The present disclosure provides a substrate processing apparatus including: a substrate holding unit that holds a substrate; a pressure regulator that regulates a pressure of a gas supplied into an elastic membrane; and a controller that controls the pressure regulator to make the pressure of the gas supplied into the elastic membrane variable in order to separate the substrate from the elastic membrane.