Heat-Resistant Memory Copying for Variable Resistance Memory Assembly

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Solution Overview

Problem

Variable resistance memory devices are susceptible to data loss due to high temperatures during the assembly of electronic devices, leading to reduced reliability and increased defects.

Innovation Solution

Storing system code in a heat-resistant NAND flash memory and copying it into a heat-vulnerable variable resistance memory after assembly, using a control circuit and bootloader to execute the transfer and update a copy flag for efficient data initialization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If variable resistance memory devices are used for data storage, then memory capacity and cost are improved, but reliability deteriorates due to heat sensitivity during assembly

Engineering Contradiction:

Improvedata retention reliabilityVSAvoidtemperature sensitivity

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system code is preliminarily stored in a heat-resistant first nonvolatile memory (NAND flash) before the assembly heating process. This preliminary storage ensures that the system code is preserved during subsequent heating operations, and can be copied to the variable resistance memory after the heating is complete, thus preventing thermal data loss.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The first nonvolatile memory (NAND flash) acts as an intermediary storage device between the heat source and the second nonvolatile memory (variable resistance memory). It temporarily holds the system code during the heating process, protecting it from thermal damage, and enables safe transfer of the code to the heat-sensitive memory after cooling.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If system code is stored in variable resistance memory from the beginning, then data initialization is simplified, but data loss occurs during high temperature exposure

Engineering Contradiction:

Improvedata initialization simplicityVSAvoidsystem code loss

Core Design Contradiction:

Ease of manufactureVSLoss of information

Solution Approach 1:

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system code is copied from the first nonvolatile memory (NAND flash) to the second nonvolatile memory (variable resistance memory) after the heating process. This copying operation ensures that the system code is transferred to the heat-sensitive memory only after it has been protected from thermal damage, maintaining data integrity while enabling simplified initialization.

Inventive Principle:

Principle #26Copying

3Reliability

If system code is copied after heating, then thermal data loss is prevented, but additional copying steps increase manufacturing complexity

Engineering Contradiction:

Improvedata integrityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The control circuit automatically detects whether the system code has been copied to the second nonvolatile memory and performs the copying operation only when necessary. This self-service mechanism reduces manual intervention and simplifies the manufacturing process while ensuring data integrity, as the system autonomously manages the code transfer based on its own state.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The control circuit uses feedback from detecting the presence or absence of the system code in the second nonvolatile memory to determine whether copying is needed. This feedback mechanism prevents unnecessary copying operations and automates the process, reducing manufacturing complexity while maintaining reliable data transfer.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method prevents thermal data loss in variable resistance memory during assembly by using a heat-resistant memory to store and transfer system code, ensuring reliable data initialization and reducing defects.

Implementation Method 1

The first nonvolatile memory and a second nonvolatile memory are heated during assembly of an electronic device including the first nonvolatile memory and a second nonvolatile memory. The heating is to a temperature sufficient to change a state of at least some memory cells in the second nonvolatile memory device.

Methodology Applied

Scientific EffectThermal heating: Heating

Data Source

PatentUS8166234B2Method of fabricating systems including heat-sensitive memory devices

Publication Date: 2012.04.24 SAMSUNG ELECTRONICS CO LTD

AI summary

A system code is stored in a first nonvolatile memory. The first nonvolatile memory and a second nonvolatile memory are heated during assembly of an electronic device including the first nonvolatile memory and a second nonvolatile memory. The heating is to a temperature sufficient to change a state of at least some memory cells in the second nonvolatile memory device. After the heating, the system code stored in the first nonvolatile memory is copied into the second nonvolatile memory. The first nonvolatile memory may he less vulnerable to temperature-related data alteration than the second nonvolatile memory. For example, the first nonvolatile memory may include a NAND flash memory and the second nonvolatile memory may include a variable resistance memory.