Variable-Resistance Side Conductors for Seamless Tiled Panels
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Solution Overview
Problem
Current electronic devices with flexible panels face challenges in achieving seamless tiling due to the need for space to bend panels, resulting in gaps between tiles, which are not ideal for high-standard display devices.
Innovation Solution
The electronic device incorporates conductive patterns with adjustable electrical resistance on the side surfaces, allowing different signal lines to correspond with varying resistance values, enabling precise signal transmission and reducing gaps between tiles by optimizing conductive pattern design in terms of width, thickness, material, and shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If soft panels are bent to reduce gaps between panels, then the presence of slits between tiling panels is reduced, but space is required for bending which prevents true seamless tiling
Solution Approach 1:
The device segments the conductive connection path into two distinct parts: a first conductive pattern on the front surface and a second conductive pattern on the side surface. This segmentation allows each part to be optimized independently, with the side surface pattern providing the necessary electrical connection without requiring panel bending space.
Solution Approach 2:
The invention transitions the conductive pattern from a two-dimensional planar layout to a three-dimensional configuration that utilizes the side surface of the substrate. By placing part of the conductive pattern on the vertical side surface, the design eliminates the need for horizontal bending space while maintaining electrical connectivity.
2Reliability
If conductive patterns with different electrical resistances are designed for different signal lines, then signal transmission is optimized, but device complexity increases
Solution Approach 1:
The invention applies local quality by assigning different electrical resistance characteristics to different conductive patterns based on their specific signal transmission requirements. Each conductive pattern can be independently optimized with appropriate width, thickness, and material selection to match the electrical load of its corresponding signal line.
Solution Approach 2:
The invention utilizes parameter changes by varying the physical dimensions (width, thickness) and material properties of conductive patterns to achieve different electrical resistances. This allows optimization of signal transmission characteristics without fundamentally changing the overall device architecture or manufacturing process.
Data Source
AI summary
An electronic device includes a substrate, a first signal line, a second signal line, a first conductive pattern and a second conductive pattern. The substrate has a top surface and a side surface surrounding the top surface. The first signal line and a second signal line are disposed on the top surface. The first conductive pattern is disposed on the side surface and electrically connected to the first signal line. The second conductive pattern is disposed on the side surface and electrically connected to the second signal line. The first conductive pattern and the second conductive pattern have different electrical resistances.