Variable-Size Device Cells for Hotspot Heat Dissipation
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Solution Overview
Problem
Integrated devices with uniform device level cells face challenges in heat dissipation as they become more densely packed, leading to overheating issues, which affects their performance and efficiency.
Innovation Solution
The design incorporates device level cells with varying sizes and configurations, with modified cells placed over hotspots to enhance heat dissipation, including the use of larger device level cells with different spacings and dummy metal layers to improve thermal management without power leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If device level cells are uniformly sized and densely packed, then manufacturing simplicity and design uniformity are improved, but heat dissipation capability deteriorates leading to hotspot formation
Solution Approach 1:
The patent applies local quality by introducing non-uniform device level cell sizes specifically in hotspot regions while maintaining uniform cells in non-hotspot areas. The device level layer includes both first device level cells with a first size and second device level cells with a second size that is different from the first size, allowing tailored thermal management in specific locations without compromising overall design simplicity
Solution Approach 2:
The patent segments the device level cells into different size categories (first device level cells and second device level cells) based on their location relative to hotspots. This segmentation allows the system to differentiate between hotspot and non-hotspot regions, applying appropriate cell sizes to each region to optimize heat dissipation while maintaining manufacturing feasibility
2Temperature
If device level cells are modified to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent limits the increase in device complexity by applying non-uniform cell sizes only locally in hotspot regions rather than throughout the entire device. The device level layer comprises a first plurality of device level cells and a second plurality of device level cells, where only the second plurality in hotspot regions has different dimensions, keeping the overall structural complexity manageable
Solution Approach 2:
The patent uses partial action by modifying only the necessary device level cells in hotspot regions rather than redesigning all cells. The second plurality of device level cells in hotspot regions are configured with different sizes to provide improved heat dissipation, while the first plurality of device level cells in non-hotspot regions maintain the original uniform configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces overheating in hotspot regions, maintaining performance while minimizing additional space requirements, thus optimizing heat dissipation and operational efficiency.
Implementation Method 1
device level cells with varying sizes and configurations, with modified cells placed over hotspots to enhance heat dissipation
Implementation Method 2
enhance heat dissipation, including the use of larger device level cells with different spacings
Data Source
AI summary
An integrated device that includes a substrate, a device level layer formed over the substrate, and interconnect portion over the device level layer. The device level layer includes a plurality of first device level cells, each first device level cell comprising a first configuration. The device level layer includes a plurality of second device level cells. At least one second device level cell includes a second configuration that is different than the first configuration. The plurality of second device level cells is located over at least one region of the integrated device comprising at least one hotspot.