Varying-Thickness Insulating Layer for Via-Safe Electrode Patterning
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Solution Overview
Problem
The existing manufacturing processes for display devices require a separate masking pattern removal process when patterning conductive layers, which can cause damage to lower via layers and reduce process efficiency.
Innovation Solution
The use of the upper organic layer as a masking pattern allows for patterning of connection electrodes without a separate masking pattern removal process, minimizing damage to the lower via layer and improving process efficiency by omitting the removal step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate masking pattern removal process is used when patterning conductive layers, then the patterning can be completed, but damage occurs to the lower via layer and process efficiency is reduced
Solution Approach 1:
The patent extracts and removes the harmful masking pattern removal process from the manufacturing sequence. By using the upper organic layer as a permanent masking pattern that is selectively removed only in non-display areas, the damaging stripping process is eliminated from the via layer area, preventing damage while maintaining patterning functionality.
Solution Approach 2:
The upper organic layer serves as an intermediary masking pattern that mediates between the need for conductive layer patterning and the protection of the lower via layer. This intermediary layer enables pattern transfer without requiring a separate masking pattern that would need to be removed, thus preventing damage to underlying structures.
2Ease of manufacture
If a separate masking pattern removal process is used, then the conductive layer can be patterned, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The patent merges the masking pattern function with the upper organic layer structure. The upper organic layer simultaneously serves as both the functional organic layer and the masking pattern for conductive layer patterning, eliminating the need for a separate masking pattern and its subsequent removal process, thereby simplifying manufacturing and reducing time loss.
Solution Approach 2:
The upper organic layer is given multiple functions: it serves as the functional organic layer for display purposes and simultaneously as the masking pattern for patterning the conductive layer. This multi-functionality eliminates the need for separate masking materials and processes, improving ease of manufacture and reducing process time.
Data Source
AI summary
A display device and a method of manufacturing a display device are provided. An embodiment of a display device includes a substrate; a first conductive layer disposed on the substrate; a first insulating layer disposed on the first conductive layer; a second conductive layer connected to the first conductive layer through a first contact hole in the first insulating layer; a second insulating layer filling an inside of the first contact hole; and a third insulating layer disposed on the second conductive layer and the second insulating layer. The first insulating layer includes a first region that overlaps the second conductive layer and a second region that does not overlap the second conductive layer, and a top surface of the first region of the first insulating layer is positioned higher than a top surface of the second region of the first insulating layer.