Vehicle Coolant Sub-Circuits With Independent Pump Flow Control
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Solution Overview
Problem
Existing coolant systems for vehicles face challenges in ensuring consistent coolant flow rate and temperature across multiple components, particularly when components are added or removed, leading to inefficiencies and increased costs.
Innovation Solution
A temperature control system with a main circuit and multiple sub-circuits, where each sub-circuit has its own pump and is connected to the main circuit through a common tubing section, allowing for independent control of coolant flow and temperature across sub-circuits without requiring pump substitution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are connected in series to ensure same coolant flow, then coolant flow consistency is improved, but coolant temperature varies across components leading to reduced cooling efficiency
Solution Approach 1:
The coolant system is divided into multiple parallel sub-circuits, each with its own pump, rather than using a single series connection. This segmentation allows independent control of coolant flow to each component, ensuring both flow consistency and appropriate temperature distribution across all components.
Solution Approach 2:
Each sub-circuit is equipped with an individually controllable pump that can adjust its operation dynamically. This allows the system to adapt coolant flow rates to match the specific thermal requirements of each component, optimizing cooling efficiency while maintaining flow consistency.
2Productivity
If a bigger pump is used to increase coolant flow rate, then coolant flow rate is improved, but system cost and pump size increase
Solution Approach 1:
Instead of using one large pump to supply all components, the system segments the coolant delivery into multiple smaller sub-circuits, each with its own appropriately sized pump. This allows each pump to be optimized for its specific load, avoiding the need for an oversized main pump and reducing overall system cost and complexity.
Solution Approach 2:
Each sub-circuit is designed with local quality in mind, having its own pump sized specifically for the cooling requirements of its associated component. This localized approach ensures adequate coolant flow rate without requiring a universally oversized pump system.
3Device complexity
If a single pump serves multiple parallel sub-circuits, then system simplicity is improved, but adaptability to changing component configurations deteriorates
Solution Approach 1:
The system is segmented into independent sub-circuits with individual pumps, allowing each sub-circuit to be added, removed, or modified independently. This modular architecture provides adaptability to changing component configurations while maintaining reasonable system simplicity through standardized sub-circuit designs.
Solution Approach 2:
Each sub-circuit is designed as a universal module that can serve different components. The standardized sub-circuit design with individual pump control allows the same configuration to be adapted to various component arrangements, providing versatility without requiring complete system redesign.
4Temperature
If components are placed close together to ensure equal cooling, then coolant temperature consistency is improved, but system flexibility and scalability deteriorate
Solution Approach 1:
The system segments coolant delivery into separate controllable sub-circuits, allowing temperature consistency to be achieved through active control of each sub-circuit rather than passive proximity arrangement. This enables components to be distributed over larger areas while maintaining consistent cooling performance and preserving system flexibility.
Solution Approach 2:
Individual pump control in each sub-circuit provides dynamic adjustment of coolant flow and temperature to match component requirements. This active control mechanism ensures temperature consistency regardless of component spacing, allowing flexible and scalable system configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system ensures consistent coolant temperature and adjustable flow rates across sub-circuits, allowing for efficient cooling or heating of components without the need for pump upgrades, thus reducing costs and improving adaptability to changing component configurations.
Implementation Method 1
the first sub-circuit comprises a first pump configured to pump a coolant in a direction from said first end of the tubing of the first sub-circuit to the second end thereof
Implementation Method 2
the second sub-circuit comprises a second pump configured to pump a coolant in a direction from said first end of the tubing of the second sub-circuit to the second end thereof
Implementation Method 3
a main circuit pump configured to pump said coolant through the tubing of the main circuit in a first direction
Implementation Method 4
at least one unit for cooling or heating the coolant in the main circuit
Implementation Method 5
at least one unit for cooling or heating the coolant in the main circuit
Data Source
AI summary
A temperature control system for a vehicle, comprising a main circuit comprising a tubing in which there is provided a coolant, a main circuit pump configured to pump said coolant through the tubing in a first direction. Connected in parallel to the main circuit are first and second sub-circuits for cooling or heating of components connected thereto. In the sub-circuits there are provided first and second pumps that pump coolant through said sub-circuits from a first end to second end at which the respective sub-circuit is connected the main circuit. The first end is upstream the second end as seen in the first direction in the first circuit, and the first end of the first sub-circuit and the first end of the at least one second sub-circuit are joined to a common tubing section which in its turn is connected to the tubing of the main circuit.