Multi-Direction Heat Dissipation for High-Power Vehicle Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation methods for high-power electronic devices, such as artificial intelligence processors in vehicles, face challenges with reliability and stability due to single-point and single-direction heat dissipation, which cannot meet the increased power consumption requirements, leading to reduced performance and failure.
Innovation Solution
The implementation of a heat dissipation system using a first heat conduction component with a higher heat conduction coefficient and lower specific heat capacity, positioned between a first heat dissipation component and a circuit board, to facilitate multi-point and multi-direction heat dissipation, combined with a silicon sheet for enhanced heat conductivity, effectively absorbing and releasing heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heat dissipation component is used, then the device structure is simple, but the heat dissipation efficiency is insufficient for high-power electronic devices
Solution Approach 1:
The heat dissipation system is divided into multiple independent heat dissipation components (first heat dissipation component, second heat dissipation component, third heat dissipation component) that dissipate heat from different locations and directions of the circuit board, transforming a single-point heat dissipation approach into a multi-point heat dissipation system to improve overall heat dissipation efficiency
Solution Approach 2:
The patent introduces multi-directional heat dissipation by positioning heat dissipation components on different sides of the circuit board (front side and back side), adding spatial dimensions to the heat dissipation approach. This transforms single-direction heat dissipation into multi-directional heat dissipation, effectively addressing the heat dissipation limitations of high-power electronic devices
2Loss of energy
If heat dissipation components are added to improve heat dissipation, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
Multiple heat dissipation components are merged into a coordinated heat dissipation system that works together to manage thermal loads. The first, second, and third heat dissipation components are positioned and configured to complement each other, creating an integrated heat dissipation solution that improves efficiency without proportionally increasing complexity
Solution Approach 2:
The heat dissipation components serve multiple functions: they dissipate heat from different regions of the circuit board, provide structural support, and in some cases offer electromagnetic shielding. This multi-functionality reduces the need for separate components, thereby improving heat dissipation efficiency without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the reliability and stability of high-power electronic devices by achieving efficient overall heat dissipation, reducing heat resistance, and providing effective anti-electromagnetic interference, ensuring normal operation of high-power devices like artificial intelligence processors in vehicles.
Implementation Method 1
a first heat conduction component comprising a first heat conduction plate and at least one first heat conduction member disposed on the first heat conduction plate and corresponding to at least one first electronic element
Implementation Method 2
a first heat dissipation component... the first heat dissipation component and the first heat conduction component are provided with a first electromagnetic shielding layer
Implementation Method 3
overall heat dissipation of an entire circuit board of the electronic device... may be implemented
Data Source
AI summary
An electronic device includes: a circuit board including a substrate and at least one first electronic element disposed on one side of the substrate; a first heat dissipation component; and a first heat conduction component including a first heat conduction plate and at least one first heat conduction member disposed on the first heat conduction plate and corresponding to the at least one first electronic element. A material of the first heat conduction component is different from that of the first heat dissipation component, and the first heat conduction component is disposed between the first heat dissipation component and the circuit board.