In-Vehicle Heat Dissipation Housing for Grease Overflow Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The use of heat dissipation grease in in-vehicle devices faces challenges such as high initial viscosity, nozzle clogging, and difficulty in maintaining a consistent application position and amount, leading to excessive application and reduced thermal conduction efficiency, which increases product costs.
Innovation Solution
A heat dissipation structure featuring a first surrounding portion within the housing that aligns with the center of the heat-generating component and a second surrounding portion outside it, with grooves to manage the thermal conductive material's application and prevent overflow, ensuring efficient thermal conduction and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat dissipation grease with high thermal conductivity is used, then thermal conduction efficiency is improved, but viscosity increases causing nozzle clogging and application difficulty
Solution Approach 1:
The patent changes the physical state parameter of the thermal conductive material from liquid (grease) to semi-solid (paste) by adjusting viscosity and adding fillers like alumina. This parameter change enables the material to be discharged smoothly from nozzles while maintaining high thermal conductivity, resolving the contradiction between thermal efficiency and application ease
2Manufacturing precision
If application amount is increased to absorb variation, then application position consistency is improved, but material overflow occurs between component and housing
Solution Approach 1:
The patent applies the thermal conductive material in advance to the entire surface of the heat generating component before assembly. This preliminary action ensures complete coverage and consistent application position, while the subsequent compression during assembly prevents overflow by confining the material within the component-housing interface
Solution Approach 2:
The patent segments the application process into two distinct stages: (1) preliminary application to the component surface, and (2) compression during assembly. This segmentation allows precise control of material distribution and prevents overflow while maintaining position consistency
3Length of moving object
If thin and long pipe is used to discharge grease, then reachability to application point is improved, but discharge difficulty increases due to high viscosity
Solution Approach 1:
The patent changes the viscosity parameter of the thermal conductive material by adjusting the grease formulation and adding fillers. This parameter change reduces resistance to flow, enabling smooth discharge through thin and long pipes while maintaining the pipe's length for reaching distant application points
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the outflow of thermal conductive material, aligns the crushed shape with the component's center, and enhances thermal conduction efficiency while reducing material costs by optimizing the application and shape of the heat dissipation grease.
Implementation Method 1
heat generated from the electronic component is transferred to the housing via the thermal conductive material and dissipated from a surface of the housing
Data Source
AI summary
An in-vehicle device includes a circuit board on which a heat generating component (electronic component) is mounted, a first housing (base member) that faces the heat generating component, and a thermal conductive material that fills a space between the heat generating component and the first housing. The first housing includes a first surrounding portion and a second surrounding portion. The first surrounding portion is formed inside a region of the first housing that overlaps with the heat generating component while having the thermal conductive material interposed therebetween, and surrounds a point in the region of the first housing that faces the center of the heat generating component. The second surrounding portion is formed outside the region of the first housing, and surrounds the first surrounding portion.