Electronic Power Device With Vertical 3D Switching Cell for Heat Extraction

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Solution Overview

Problem

Existing 2D power electronic devices face limitations in heat extraction, electromagnetic interference, and assembly efficiency, with 3D assemblies facing challenges in collective production and effective heat dissipation.

Innovation Solution

A 3D power electronic device is designed with vertical stacking of components on a support, utilizing a copper-based metal frame for electrical connections and decoupling capacitors to minimize electromagnetic interference, and produced through a collective process for efficient assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a 2D planar implementation is used with chips fixed on a metallized substrate, then assembly reliability is achieved, but heat extraction capacity is limited and parasitic electromagnetic elements are introduced

Engineering Contradiction:

Improveassembly reliabilityVSAvoidheat extraction capacity

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent transitions from a 2D planar arrangement to a 3D vertical stacking architecture. Multiple power electronic chips are stacked vertically with interleaved metallizations, enabling heat extraction from multiple surfaces and reducing parasitic electromagnetic elements through compact vertical integration rather than horizontal spreading.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If a 2D planar implementation is used with chips fixed on a metallized substrate, then assembly reliability is achieved, but parasitic electromagnetic elements are introduced

Engineering Contradiction:

Improveassembly reliabilityVSAvoidparasitic electromagnetic elements

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If a DBC substrate is used for electrical insulation and power contact isolation, then electrical insulation is achieved, but thermal conductivity is limited

Engineering Contradiction:

Improveelectrical insulationVSAvoidthermal conductivity

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent employs a composite structure combining metallized ceramic substrates (DBC type) with direct copper bonding and vertical stacking. The interleaved metallizations include copper layers bonded directly to chip surfaces, creating a composite thermal pathway that bypasses the insulating ceramic while maintaining electrical isolation through the vertical architecture.

Inventive Principle:

Principle #40Composite materials

4Temperature

If a vertical 3D stacking architecture is used, then heat dissipation is enhanced and electromagnetic interference is reduced, but collective production complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidcollective production complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-assembling stacks of power electronic chips with their metallizations before mounting on the support. The interleaved metallization layers are prepared in advance on each chip, and the stacking sequence is predetermined, allowing collective production through systematic assembly rather than complex post-assembly interconnections.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The vertical arrangement enhances heat dissipation, reduces electromagnetic interference, and allows for compact, reliable, and efficient production of power electronic devices.

Implementation Method 1

a solder forming an electrothermal connection between the first chip 12 and the first metallization 13

Methodology Applied

Scientific EffectElectrothermal connection: Conduction (electrical)

Implementation Method 2

a solder forming an electrothermal connection between the first chip 12 and the first metallization 13

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

A rear face of the sole 16 is secured to a heat sink 18 by means of a thermal grease 20

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3216056B1Electronic power device with vertical 3D switching cell

Publication Date: 2025.10.15 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Figure 1~2
Figure 3~4
Figure 5A~5B

AI summary

The invention relates to an electronic power device which includes a first electronic power component (108) in which all the electrodes are arranged on a first main surface of the first electronic power component, and an electric contact element (114) in which a first main surface is arranged against the first main surface of the first electronic power component, and which comprises a plurality of separate electrically conductive portions to which the electrodes of the first electronic power component are electrically connected, in which the first electronic power component and the electric contact element together form a stack such that a first side surface of each of the portions of the electric contact element, substantially perpendicular to the first main surface of the electric contact element, is arranged against at least one metallisation of a substrate forming an electric contact of the first electronic power component.