Vertical Rotating Arm Transfer Device for Large Substrates
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Solution Overview
Problem
Current transfer devices are limited by the radius of their rotating arm, restricting the size of substrates they can handle and resulting in inefficient tact times for electronic component transfer.
Innovation Solution
The transfer device features pick-and-place modules with a rotating arm that rotates vertically relative to the substrate, allowing for larger substrate sizes and reduced tact times through reduced radius and increased efficiency with multiple modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the rotating arm rotates horizontally relative to the substrate, then the transfer device can handle substrates within a limited radius, but the substrate size is restricted and cannot achieve large-scale operation
Solution Approach 1:
The rotating arm is changed from horizontal rotation to vertical rotation relative to the substrate. This dimensional change allows the substrate to extend beyond the rotating arm's radius limitation, enabling large-scale substrate operation while maintaining a compact rotating arm structure.
2Area of stationary object
If the rotating arm has a large radius to accommodate larger substrates, then the substrate size limit is increased, but the tact time increases and efficiency decreases
Solution Approach 1:
By rotating the arm vertically rather than horizontally, the system achieves large substrate coverage without increasing the rotating arm's radius. This maintains a compact rotation path and reduces the distance for component transfer, thereby reducing tact time while supporting large substrates.
Solution Approach 2:
The transfer device is divided into multiple pick-and-place modules that can operate independently or in coordination. This segmentation allows parallel processing of different substrate regions, reducing overall tact time while maintaining the ability to handle large substrates.
3Productivity
If multiple pick-and-place modules are used to reduce tact time, then the transfer efficiency is improved, but the device complexity increases
Solution Approach 1:
The system is divided into multiple identical pick-and-place modules, each capable of independent operation. This modular segmentation enables parallel processing to improve productivity while maintaining manageable complexity through standardized module design and potential coordinated control.
Data Source
AI summary
A transfer device, including a substrate and multiple pick-and-place modules, is provided. The pick-and-place modules are disposed on the substrate to transfer multiple electronic components onto the substrate. At least one pick-and-place module includes a rotating arm that rotates vertically relative to the substrate.